Arama Sonuçları Packaging. - Daraltılmış: Electronic circuits.
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https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Electronic$002bcircuits.$002509Electronic$002bcircuits.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-01-15T07:01:02Z
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Interconnect Reliability in Advanced Memory Device Packaging
ent://SD_ILS/0/SD_ILS:526838
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-031-26708-6">https://doi.org/10.1007/978-3-031-26708-6</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Electronic and photonic circuits and devices
ent://SD_ILS/0/SD_ILS:249690
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Mapping Innovation The Discipline of Building Opportunity across Value Chains
ent://SD_ILS/0/SD_ILS:526682
2026-01-15T07:01:02Z
2026-01-15T07:01:02Z
Yazar Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-030-93627-3">https://doi.org/10.1007/978-3-030-93627-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>