Arama Sonuçları Packaging. - Daraltılmış: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Electronics.$002509Electronics.$0026te$003dILS$0026ps$003d300?dt=list
2024-12-26T04:11:50Z
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:167565
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE(330808.1)<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
RF and Microwave Microelectronics Packaging
ent://SD_ILS/0/SD_ILS:172116
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Nanopackaging Nanotechnologies and Electronics Packaging
ent://SD_ILS/0/SD_ILS:166372
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Morris, James E. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-47325-3">http://dx.doi.org/10.1007/978-0-387-47325-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Integrated Circuit Packaging, Assembly and Interconnections
ent://SD_ILS/0/SD_ILS:165984
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Greig, William J. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Modeling and Application of Flexible Electronics Packaging
ent://SD_ILS/0/SD_ILS:484436
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-13-3627-0">https://doi.org/10.1007/978-981-13-3627-0</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Nano-Bio- Electronic, Photonic and MEMS Packaging
ent://SD_ILS/0/SD_ILS:171848
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Materials for Information Technology Devices, Interconnects and Packaging
ent://SD_ILS/0/SD_ILS:175333
2024-12-26T04:11:50Z
2024-12-26T04:11:50Z
Yazar Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>