Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: Engineering design. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Engineering$002bdesign.$002509Engineering$002bdesign.$0026ic$003dtrue$0026ps$003d300? 2025-12-31T16:23:04Z Packaging for Sustainability ent://SD_ILS/0/SD_ILS:168649 2025-12-31T16:23:04Z 2025-12-31T16:23:04Z Yazar&#160;Verghese, Karli. editor.&#160;Lewis, Helen. editor.&#160;Fitzpatrick, Leanne. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-0-85729-988-8">http://dx.doi.org/10.1007/978-0-85729-988-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2025-12-31T16:23:04Z 2025-12-31T16:23:04Z Yazar&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Systems-Level Packaging for Millimeter-Wave Transceivers ent://SD_ILS/0/SD_ILS:484945 2025-12-31T16:23:04Z 2025-12-31T16:23:04Z Yazar&#160;Bo&#382;ani&#263;, Mladen. author. (orcid)0000-0001-9174-0781&#160;Sinha, Saurabh. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-030-14690-0">https://doi.org/10.1007/978-3-030-14690-0</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2025-12-31T16:23:04Z 2025-12-31T16:23:04Z Yazar&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications ent://SD_ILS/0/SD_ILS:529641 2025-12-31T16:23:04Z 2025-12-31T16:23:04Z Yazar&#160;Zheng Li, Jeremy. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-05921-1">https://doi.org/10.1007/978-3-319-05921-1</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>