Arama Sonuçları Packaging. - Daraltılmış: Engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Engineering.$002509Engineering.$0026ps$003d300?
2025-12-27T12:25:21Z
Packaging for Sustainability
ent://SD_ILS/0/SD_ILS:168649
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-85729-988-8">http://dx.doi.org/10.1007/978-0-85729-988-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE(330808.1)<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Fan-Out Wafer-Level Packaging
ent://SD_ILS/0/SD_ILS:399728
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-10-8884-1">https://doi.org/10.1007/978-981-10-8884-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
RF and Microwave Microelectronics Packaging
ent://SD_ILS/0/SD_ILS:172116
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Integrated Circuit Packaging, Assembly and Interconnections
ent://SD_ILS/0/SD_ILS:165984
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Greig, William J. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
ent://SD_ILS/0/SD_ILS:400941
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Seok, Seonho. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Materials for Information Technology Devices, Interconnects and Packaging
ent://SD_ILS/0/SD_ILS:175333
2025-12-27T12:25:21Z
2025-12-27T12:25:21Z
Yazar Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>