Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: Manufactures. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Manufactures.$002509Manufactures.$0026te$003dILS$0026ps$003d300? 2025-01-13T12:03:43Z Modeling and Application of Flexible Electronics Packaging ent://SD_ILS/0/SD_ILS:484436 2025-01-13T12:03:43Z 2025-01-13T12:03:43Z Yazar&#160;Huang, YongAn. author.&#160;Yin, Zhouping. author.&#160;Wan, Xiaodong. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-981-13-3627-0">https://doi.org/10.1007/978-981-13-3627-0</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method ent://SD_ILS/0/SD_ILS:400941 2025-01-13T12:03:43Z 2025-01-13T12:03:43Z Yazar&#160;Seok, Seonho. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>