Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: Materials. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Materials.$002509Materials.$0026ps$003d300? 2024-09-21T07:56:20Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2024-09-21T07:56:20Z 2024-09-21T07:56:20Z Yazar&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Food packaging Materiali, tecnologie e qualit&agrave; degli alimenti ent://SD_ILS/0/SD_ILS:204419 2024-09-21T07:56:20Z 2024-09-21T07:56:20Z Yazar&#160;Piergiovanni, Luciano. author.&#160;Limbo, Sara. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-88-470-1457-2">http://dx.doi.org/10.1007/978-88-470-1457-2</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Materials for Information Technology Devices, Interconnects and Packaging ent://SD_ILS/0/SD_ILS:175333 2024-09-21T07:56:20Z 2024-09-21T07:56:20Z Yazar&#160;Zschech, Ehrenfried. editor.&#160;Whelan, Caroline. editor.&#160;Mikolajick, Thomas. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>