Arama Sonuçları Packaging. - Daraltılmış: Microelectromechanical systems.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Microelectromechanical$002bsystems.$002509Microelectromechanical$002bsystems.$0026ps$003d300?2026-01-01T09:57:50ZChiplet Design and Heterogeneous Integration Packagingent://SD_ILS/0/SD_ILS:5276842026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS/MOEMS packaging concepts, designs, materials, and processesent://SD_ILS/0/SD_ILS:2935992026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Gilleo, Ken.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modulesent://SD_ILS/0/SD_ILS:5298872026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS : fundamental technology and applicationsent://SD_ILS/0/SD_ILS:5474552026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Choudhary, Vikas. Iniewski, Krzysztof.<br/>Yer Numarası TK7875 .M457 2013<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781315216393">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applicationsent://SD_ILS/0/SD_ILS:5458572026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Jha, A. R., author.<br/>Yer Numarası TK7875 .J485 2008<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9780849380709">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS and Microstructures in aerospace applicationsent://SD_ILS/0/SD_ILS:5474942026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.<br/>Yer Numarası TL589 .O85 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420027747">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>Microengineering, MEMS, and interfacing : a practical guideent://SD_ILS/0/SD_ILS:5448432026-01-01T09:57:50Z2026-01-01T09:57:50ZYazar Banks, Danny., author.<br/>Yer Numarası TK7875 .B36 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420015416">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>