Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: Surfaces (Physics). SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Surfaces$002b$002528Physics$002529.$002509Surfaces$002b$002528Physics$002529.$0026ps$003d300? 2024-11-13T08:07:27Z Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method ent://SD_ILS/0/SD_ILS:400941 2024-11-13T08:07:27Z 2024-11-13T08:07:27Z Yazar&#160;Seok, Seonho. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging ent://SD_ILS/0/SD_ILS:196467 2024-11-13T08:07:27Z 2024-11-13T08:07:27Z Yazar&#160;Gerlach, Gerald. editor.&#160;Wolter, Klaus-J&uuml;rgen. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-3-642-28522-6">http://dx.doi.org/10.1007/978-3-642-28522-6</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-11-13T08:07:27Z 2024-11-13T08:07:27Z Yazar&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Materials for Information Technology Devices, Interconnects and Packaging ent://SD_ILS/0/SD_ILS:175333 2024-11-13T08:07:27Z 2024-11-13T08:07:27Z Yazar&#160;Zschech, Ehrenfried. editor.&#160;Whelan, Caroline. editor.&#160;Mikolajick, Thomas. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>