Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: Systems engineering. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Konu$002509Systems$002bengineering.$002509Systems$002bengineering.$0026ic$003dtrue$0026ps$003d300? 2024-11-11T01:19:05Z Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2024-11-11T01:19:05Z 2024-11-11T01:19:05Z Yazar&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE(330808.1)<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Fan-Out Wafer-Level Packaging ent://SD_ILS/0/SD_ILS:399728 2024-11-11T01:19:05Z 2024-11-11T01:19:05Z Yazar&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-981-10-8884-1">https://doi.org/10.1007/978-981-10-8884-1</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> RF and Microwave Microelectronics Packaging ent://SD_ILS/0/SD_ILS:172116 2024-11-11T01:19:05Z 2024-11-11T01:19:05Z Yazar&#160;Kuang, Ken. editor.&#160;Kim, Franklin. editor.&#160;Cahill, Sean S. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2024-11-11T01:19:05Z 2024-11-11T01:19:05Z Yazar&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Power Electronic Packaging Design, Assembly Process, Reliability and Modeling ent://SD_ILS/0/SD_ILS:173841 2024-11-11T01:19:05Z 2024-11-11T01:19:05Z Yazar&#160;Liu, Yong. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>