Arama Sonuçları Packaging. - Daraltılmış: Microelectromechanical systems.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Microelectromechanical$002bsystems.$002509Microelectromechanical$002bsystems.$0026ps$003d300?2025-12-27T18:41:35ZChiplet Design and Heterogeneous Integration Packagingent://SD_ILS/0/SD_ILS:5276842025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS/MOEMS packaging concepts, designs, materials, and processesent://SD_ILS/0/SD_ILS:2935992025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Gilleo, Ken.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modulesent://SD_ILS/0/SD_ILS:5298872025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS : fundamental technology and applicationsent://SD_ILS/0/SD_ILS:5474552025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Choudhary, Vikas. Iniewski, Krzysztof.<br/>Yer Numarası TK7875 .M457 2013<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781315216393">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applicationsent://SD_ILS/0/SD_ILS:5458572025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Jha, A. R., author.<br/>Yer Numarası TK7875 .J485 2008<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9780849380709">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>Microengineering, MEMS, and interfacing : a practical guideent://SD_ILS/0/SD_ILS:5448432025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Banks, Danny., author.<br/>Yer Numarası TK7875 .B36 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420015416">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS and Microstructures in aerospace applicationsent://SD_ILS/0/SD_ILS:5474942025-12-27T18:41:35Z2025-12-27T18:41:35ZYazar Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.<br/>Yer Numarası TL589 .O85 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420027747">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>