Arama Sonuçları Packaging. - Daraltılmış: Telecommunication.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Telecommunication.$002509Telecommunication.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-03-29T17:05:05Z
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2026-03-29T17:05:05Z
2026-03-29T17:05:05Z
Yazar Tai-Ran Hsu, ed.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
RF and Microwave Microelectronics Packaging II
ent://SD_ILS/0/SD_ILS:616783
2026-03-29T17:05:05Z
2026-03-29T17:05:05Z
Yazar Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-51697-4">https://doi.org/10.1007/978-3-319-51697-4</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-03-29T17:05:05Z
2026-03-29T17:05:05Z
Yazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Enabling the Internet of Things From Integrated Circuits to Integrated Systems
ent://SD_ILS/0/SD_ILS:616591
2026-03-29T17:05:05Z
2026-03-29T17:05:05Z
Yazar Alioto, Massimo. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-51482-6">https://doi.org/10.1007/978-3-319-51482-6</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>