Arama Sonuçları Reliability. - Daraltılmış: Microelectronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dReliability.$0026qf$003dSUBJECT$002509Konu$002509Microelectronic$002bpackaging.$002509Microelectronic$002bpackaging.$0026ic$003dtrue$0026ps$003d300?
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Semiconductor packaging : materials interaction and reliability
ent://SD_ILS/0/SD_ILS:546600
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Yazar Chen, Andrea., author. Lo, Randy.<br/>Yer Numarası TK7870.15 .C54 2012<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781439862070">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
ent://SD_ILS/0/SD_ILS:460117
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Yazar Suganuma, Katsuaki, editor.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Antenna-in-package technology and applications
ent://SD_ILS/0/SD_ILS:595805
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Yazar Liu, Duixian, editor. Zhang, Yueping, editor.<br/>Yer Numarası TK7871.67 .M5 A58 2020<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Introduction to microsystem packaging technology
ent://SD_ILS/0/SD_ILS:546454
2026-03-10T11:40:29Z
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Yazar Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-<br/>Yer Numarası TK7870.15 .J56 2011<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781315217086">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>