Arama Sonu&ccedil;lar&#305; Reliability. - Daralt&#305;lm&#305;&#351;: Microelectronic packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dReliability.$0026qf$003dSUBJECT$002509Konu$002509Microelectronic$002bpackaging.$002509Microelectronic$002bpackaging.$0026ic$003dtrue$0026ps$003d300$0026isd$003dtrue?dt=list 2025-03-27T23:39:35Z Semiconductor packaging materials interaction and reliability ent://SD_ILS/0/SD_ILS:288970 2025-03-27T23:39:35Z 2025-03-27T23:39:35Z Yazar&#160;Chen, Andrea.&#160;Lo, Randy.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781439862070">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability ent://SD_ILS/0/SD_ILS:460117 2025-03-27T23:39:35Z 2025-03-27T23:39:35Z Yazar&#160;Suganuma, Katsuaki, editor.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Introduction to microsystem packaging technology ent://SD_ILS/0/SD_ILS:291551 2025-03-27T23:39:35Z 2025-03-27T23:39:35Z Yazar&#160;Jin, Yufeng.&#160;Wang, Zhiping, 1962- Oct. 6-&#160;Chen, Jing, 1974-<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>