Arama Sonuçları Semiconductor wafers. - Daraltılmış: EnglishSirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSemiconductor$002bwafers.$0026qf$003dLANGUAGE$002509Dil$002509ENG$002509English$0026ic$003dtrue$0026ps$003d300?dt=list2024-11-26T01:33:05ZSapphire structure, technology, and applicationsent://SD_ILS/0/SD_ILS:2808072024-11-26T01:33:05Z2024-11-26T01:33:05ZYazar Tartaglia, Isaias, editor of compilation.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim EBSCOhost <a href="http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=548982">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=548982</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Through-silicon vias for 3D integrationent://SD_ILS/0/SD_ILS:2934782024-11-26T01:33:05Z2024-11-26T01:33:05ZYazar Lau, John.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of wafer bondingent://SD_ILS/0/SD_ILS:3061622024-11-26T01:33:05Z2024-11-26T01:33:05ZYazar Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9783527644223">http://dx.doi.org/10.1002/9783527644223</a>
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