Arama Sonuçları Semiconductor wafers. - Daraltılmış: 2012
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSemiconductor$002bwafers.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092012$0025092012$0026ic$003dtrue$0026ps$003d300?dt=list
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Through-silicon vias for 3D integration
ent://SD_ILS/0/SD_ILS:293478
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2024-11-25T20:28:23Z
Yazar Lau, John.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Handbook of wafer bonding
ent://SD_ILS/0/SD_ILS:306162
2024-11-25T20:28:23Z
2024-11-25T20:28:23Z
Yazar Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9783527644223">http://dx.doi.org/10.1002/9783527644223</a>
Ebook Library <a href="http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735">http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>