Arama Sonu&ccedil;lar&#305; Semiconductors. - Daralt&#305;lm&#305;&#351;: Microelectronic packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSemiconductors.$0026qf$003dSUBJECT$002509Konu$002509Microelectronic$002bpackaging.$002509Microelectronic$002bpackaging.$0026te$003dILS$0026ps$003d300?dt=list 2024-12-27T09:02:08Z Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability ent://SD_ILS/0/SD_ILS:460117 2024-12-27T09:02:08Z 2024-12-27T09:02:08Z Yazar&#160;Suganuma, Katsuaki, editor.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> 3D IC stacking technology ent://SD_ILS/0/SD_ILS:293493 2024-12-27T09:02:08Z 2024-12-27T09:02:08Z Yazar&#160;Wu, Banqiu.&#160;Kumar, Ajay.&#160;Ramaswami, Sesh.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>