Arama Sonu&ccedil;lar&#305; Surfaces. - Daralt&#305;lm&#305;&#351;: Chemistry, inorganic. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSurfaces.$0026qf$003dSUBJECT$002509Konu$002509Chemistry$00252C$002binorganic.$002509Chemistry$00252C$002binorganic.$0026ic$003dtrue$0026ps$003d300? 2024-11-14T11:04:01Z Biomimetics Bioinspired Hierarchical-Structured Surfaces for Green Science and Technology ent://SD_ILS/0/SD_ILS:195938 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Bhushan, Bharat. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-3-642-25408-6">http://dx.doi.org/10.1007/978-3-642-25408-6</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Multiscale Dissipative Mechanisms and Hierarchical Surfaces Friction, Superhydrophobicity, and Biomimetics ent://SD_ILS/0/SD_ILS:188124 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Nosonovsky, Michael. author.&#160;Bhushan, Bharat. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-3-540-78425-8">http://dx.doi.org/10.1007/978-3-540-78425-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Advances in Materials Processing Proceedings of Chinese Materials Conference 2017 ent://SD_ILS/0/SD_ILS:400686 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Han, Yafang. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-981-13-0107-0">https://doi.org/10.1007/978-981-13-0107-0</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Carbon The Black, the Gray and the Transparent ent://SD_ILS/0/SD_ILS:402149 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Gupta, Tapan. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-66405-7">https://doi.org/10.1007/978-3-319-66405-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method ent://SD_ILS/0/SD_ILS:400941 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Seok, Seonho. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Proceedings of Fatigue, Durability and Fracture Mechanics ent://SD_ILS/0/SD_ILS:402562 2024-11-14T11:04:01Z 2024-11-14T11:04:01Z Yazar&#160;Seetharamu, S. editor.&#160;Rao, K. 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