Arama Sonuçları System safety. - Daraltılmış: Optical materials.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSystem$002bsafety.$0026qf$003dSUBJECT$002509Konu$002509Optical$002bmaterials.$002509Optical$002bmaterials.$0026ps$003d300?2024-11-14T07:23:37ZThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnectsent://SD_ILS/0/SD_ILS:1684632024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Applications of Finite Element Methods for Reliability Studies on ULSI Interconnectionsent://SD_ILS/0/SD_ILS:1684862024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-85729-310-7">http://dx.doi.org/10.1007/978-0-85729-310-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Reliability of Microtechnology Interconnects, Devices and Systemsent://SD_ILS/0/SD_ILS:1724202024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-5760-3">http://dx.doi.org/10.1007/978-1-4419-5760-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereichent://SD_ILS/0/SD_ILS:1912782024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Wiese, Steffen. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-3-642-05463-1">http://dx.doi.org/10.1007/978-3-642-05463-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Solder Joint Reliability Prediction for Multiple Environmentsent://SD_ILS/0/SD_ILS:1676732024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packagingent://SD_ILS/0/SD_ILS:1659002024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronicsent://SD_ILS/0/SD_ILS:1664052024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Subramanian, K. N. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-48433-4">http://dx.doi.org/10.1007/978-0-387-48433-4</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>A Guide to Lead-free Solders Physical Metallurgy and Reliabilityent://SD_ILS/0/SD_ILS:1753732024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-84628-310-9">http://dx.doi.org/10.1007/978-1-84628-310-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Solder Joint Technology Materials, Properties, and Reliabilityent://SD_ILS/0/SD_ILS:1662522024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Tu, King-Ning. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Force Sensors for Microelectronic Packaging Applicationsent://SD_ILS/0/SD_ILS:1810962024-11-14T07:23:37Z2024-11-14T07:23:37ZYazar Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>