Arama Sonuçları System. - Daraltılmış: Optical materials.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dSystem.$0026qf$003dSUBJECT$002509Konu$002509Optical$002bmaterials.$002509Optical$002bmaterials.$0026ps$003d300?dt=list
2024-11-26T23:41:03Z
Modeling and Simulation for RF System Design
ent://SD_ILS/0/SD_ILS:165398
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Frevert, Ronny. author. Haase, Joachim. author. Jancke, Roland. author. Knöchel, Uwe. author. Schwarz, Peter. author.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-27585-1">http://dx.doi.org/10.1007/0-387-27585-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Introduction to Advanced System-on-Chip Test Design and Optimization
ent://SD_ILS/0/SD_ILS:165162
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Larsson, Erik. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b135763">http://dx.doi.org/10.1007/b135763</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
ent://SD_ILS/0/SD_ILS:168486
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-85729-310-7">http://dx.doi.org/10.1007/978-0-85729-310-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ent://SD_ILS/0/SD_ILS:168463
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Reliability of Microtechnology Interconnects, Devices and Systems
ent://SD_ILS/0/SD_ILS:172420
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-5760-3">http://dx.doi.org/10.1007/978-1-4419-5760-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
ent://SD_ILS/0/SD_ILS:191278
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Wiese, Steffen. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-3-642-05463-1">http://dx.doi.org/10.1007/978-3-642-05463-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Solder Joint Reliability Prediction for Multiple Environments
ent://SD_ILS/0/SD_ILS:167673
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
A Guide to Lead-free Solders Physical Metallurgy and Reliability
ent://SD_ILS/0/SD_ILS:175373
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-84628-310-9">http://dx.doi.org/10.1007/978-1-84628-310-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
ent://SD_ILS/0/SD_ILS:166405
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Subramanian, K. N. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-48433-4">http://dx.doi.org/10.1007/978-0-387-48433-4</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Solder Joint Technology Materials, Properties, and Reliability
ent://SD_ILS/0/SD_ILS:166252
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Tu, King-Ning. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
2024-11-26T23:41:03Z
2024-11-26T23:41:03Z
Yazar Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>