Arama Sonuçları Three-dimensional integrated circuits.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dThree-dimensional$002bintegrated$002bcircuits.$0026ic$003dtrue$0026ps$003d300?dt=list2024-11-29T15:57:05ZThree-dimensional integrated circuit designent://SD_ILS/0/SD_ILS:4596302024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780124105010">http://www.sciencedirect.com/science/book/9780124105010</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Design of 3D integrated circuits and systemsent://SD_ILS/0/SD_ILS:3567682024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Sharma, Rohit, editor.<br/>Yer Numarası ONLINE(356768.1)<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781466589421">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of 3D Integration : 3D process technologyent://SD_ILS/0/SD_ILS:3422102024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.<br/>Yer Numarası ONLINE(342210.1)<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9783527670109">http://dx.doi.org/10.1002/9783527670109</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Vertical 3D memory technologiesent://SD_ILS/0/SD_ILS:3417302024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Prince, Betty, author.<br/>Yer Numarası ONLINE(341730.1)<br/>Elektronik Erişim ebrary <a href="http://alltitles.ebrary.com/Doc?id=10899788">An electronic book accessible through the World Wide Web; click to view</a>
John Wiley <a href="http://dx.doi.org/10.1002/9781118760475">http://dx.doi.org/10.1002/9781118760475</a>
Safari Books Online <a href="http://proquest.safaribooksonline.com/?fpi=9781118760468">http://proquest.safaribooksonline.com/?fpi=9781118760468</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2493612024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Li, Er-Ping. Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim IEEEXplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2698672024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Li, Er-Ping.<br/>Yer Numarası TK7874.893 L53 2012<br/>Format: Kitap<br/>Durum Beytepe Kütüphanesi~1<br/>Through-silicon vias for 3D integrationent://SD_ILS/0/SD_ILS:2934782024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Lau, John.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>3D IC stacking technologyent://SD_ILS/0/SD_ILS:2934932024-11-29T15:57:05Z2024-11-29T15:57:05ZYazar Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>