Arama Sonu&ccedil;lar&#305; Wong, C. P. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dWong$00252C$002bC.$002bP.$0026ps$003d300? 2024-11-13T07:27:51Z Nano-Bio- Electronic, Photonic and MEMS Packaging ent://SD_ILS/0/SD_ILS:171848 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Wong, C.P. editor.&#160;Moon, Kyoung-Sik. editor.&#160;Li, Yi (Grace). editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging ent://SD_ILS/0/SD_ILS:110448 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Suhir, Ephraim.&#160;Lee, Y. C.&#160;Wong, C. P.<br/>Yer Numaras&#305;&#160;TK7874 .M438 2007 V.1<br/>Format:&#160;Kitap<br/>Durum&#160;Beytepe K&uuml;t&uuml;phanesi~2<br/> Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE(330808.1)<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Electrical Conductive Adhesives with Nanotechnologies ent://SD_ILS/0/SD_ILS:167909 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Li, Yi. author.&#160;Lu, Daniel. author.&#160;Wong, C. P. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Smart materials ent://SD_ILS/0/SD_ILS:286009 2024-11-13T07:27:51Z 2024-11-13T07:27:51Z Yazar&#160;Schwartz, Mel M.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781420043730">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>