Arama Sonuçları Wong, C. P. - Daraltılmış: Systems engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dWong$00252C$002bC.$002bP.$0026qf$003dSUBJECT$002509Konu$002509Systems$002bengineering.$002509Systems$002bengineering.$0026ps$003d300?dt=list
2026-03-15T21:14:28Z
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2026-03-15T21:14:28Z
2026-03-15T21:14:28Z
Yazar Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE(330808.1)<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Electrical Conductive Adhesives with Nanotechnologies
ent://SD_ILS/0/SD_ILS:167909
2026-03-15T21:14:28Z
2026-03-15T21:14:28Z
Yazar Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>