Arama Sonu&ccedil;lar&#305; packaging. - Daralt&#305;lm&#305;&#351;: Chip scale packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dpackaging.$0026qf$003dSUBJECT$002509Konu$002509Chip$002bscale$002bpackaging.$002509Chip$002bscale$002bpackaging.$0026ps$003d300? 2026-01-22T09:07:23Z MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2026-01-22T09:07:23Z 2026-01-22T09:07:23Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Advances in embedded and fan-out wafer level packaging technologies ent://SD_ILS/0/SD_ILS:594706 2026-01-22T09:07:23Z 2026-01-22T09:07:23Z Yazar&#160;Keser, Beth, 1971- editor.&#160;Kroehnert, Steffen, 1970- editor.<br/>Yer Numaras&#305;&#160;TK7870.17 .A38 2019<br/>Elektronik Eri&#351;im&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Microwave Field-Effect Transistors Theory, design and applications ent://SD_ILS/0/SD_ILS:248009 2026-01-22T09:07:23Z 2026-01-22T09:07:23Z Yazar&#160;Pengelly, Raymond S.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1049/SBEW016E">http://dx.doi.org/10.1049/SBEW016E</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>