Arama Sonuçları packaging. - Daraltılmış: Three-dimensional integrated circuits.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dpackaging.$0026qf$003dSUBJECT$002509Konu$002509Three-dimensional$002bintegrated$002bcircuits.$002509Three-dimensional$002bintegrated$002bcircuits.$0026ic$003dtrue$0026ps$003d300?2026-01-22T18:28:41ZElectrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2698672026-01-22T18:28:41Z2026-01-22T18:28:41ZYazar Li, Er-Ping.<br/>Yer Numarası TK7874.893 L53 2012<br/>Format: Kitap<br/>Durum Beytepe Kütüphanesi~1<br/>Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2493612026-01-22T18:28:41Z2026-01-22T18:28:41ZYazar Li, Er-Ping. Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim IEEEXplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>3D IC stacking technologyent://SD_ILS/0/SD_ILS:2934932026-01-22T18:28:41Z2026-01-22T18:28:41ZYazar Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>