3D IC stacking technology
tarafından
 
Wu, Banqiu.

Başlık
: 
3D IC stacking technology

Yazar
: 
Wu, Banqiu.

ISBN
: 
9780071741965

Yayın Bilgileri
: 
New York : McGraw Hill Professional, 2011.

Fiziksel Tanımlama
: 
1 electronic text (xviii, 521 p. : ill.) : PDF file.

Seri
: 
McGraw Hill ebook library. Engineering and computing. Electrical and electronic

Seri Başlığı
: 
McGraw Hill ebook library. Engineering and computing. Electrical and electronic

Konu Terimleri
: 
Three-dimensional integrated circuits.
 
Three-dimensional integrated circuits -- Design and construction.
 
Microelectronic packaging.
 
Semiconductors -- Design and construction.
 
Electronic apparatus and appliances -- Design and construction.
 
Multichip modules (Microelectronics)
 
Three-dimensional integrated circuits -- Computer-aided design.
 
Three-dimensional integrated circuits -- Testing.
 
Integrated circuits industry.

Yazar Ek Girişi
: 
Wu, Banqiu.
 
Kumar, Ajay.
 
Ramaswami, Sesh.

Elektronik Erişim
: 
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