Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
tarafından
 
Seok, Seonho. author.

Başlık
: 
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Yazar
: 
Seok, Seonho. author.

ISBN
: 
9783319778723

Basım Bilgisi
: 
1st ed. 2018.

Fiziksel Tanımlama
: 
VIII, 115 p. 106 illus. online resource.

Seri
: 
Springer Series in Advanced Manufacturing,

Konu Terimleri
: 
Manufactures.
 
Nanotechnology.
 
Engineering.
 
Surfaces (Physics).
 
Chemistry, inorganic.

Tüzel Kişi Ek Girişi
: 
SpringerLink (Online service)

Elektronik Erişim
: 
https://doi.org/10.1007/978-3-319-77872-3


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