Interconnect Reliability in Advanced Memory Device Packaging
tarafından
Gan, Chong Leong,. author.
Başlık
:
Interconnect Reliability in Advanced Memory Device Packaging
Yazar
:
Gan, Chong Leong,. author.
ISBN
:
9783031267086
Basım Bilgisi
:
1st ed. 2023.
Fiziksel Tanımlama
:
XVIII, 210 p. 100 illus., 89 illus. in color. online resource.
Seri
:
Springer Series in Reliability Engineering,
İçerik
:
Chapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.
Konu Terimleri
:
Computers.
Electronic circuits.
Hardware Performance and Reliability.
Electronic Circuits and Systems.
Yazar Ek Girişi
:
Huang, Chen-Yu,.
Tüzel Kişi Ek Girişi
:
SpringerLink (Online service)
Elektronik Erişim
:
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