Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
tarafından
Lee, Tae-Kyu. author.
Başlık
:
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Yazar
:
Lee, Tae-Kyu. author.
ISBN
:
9781461492665
Basım Bilgisi
:
1st ed. 2015.
Fiziksel Tanımlama
:
XIII, 253 p. 151 illus., 81 illus. in color. online resource.
İçerik
:
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
Konu Terimleri
:
Electronics.
Optical materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Yazar Ek Girişi
:
Bieler, Thomas R.
Kim, Choong-Un.
Ma, Hongtao.
Tüzel Kişi Ek Girişi
:
SpringerLink (Online service)
Elektronik Erişim
:
| Kütüphane | Materyal Türü | Demirbaş Numarası | Yer Numarası | [[missing key: search.ChildField.HOLDING]] | Durumu/İade Tarihi |
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| Çevrimiçi Kütüphane | E-Kitap | 530321-1001 | ONLINE | | Elektronik Kütüphane |