Ceramic interconnect technology handbook
tarafından
Barlow, Fred D.
Başlık
:
Ceramic interconnect technology handbook
Yazar
:
Barlow, Fred D.
ISBN
:
9781420018967
Fiziksel Tanımlama
:
1 online resource (441 pages)
İçerik
:
chapter 1 Overview of Ceramic Interconnect Technolgy -- chapter 2 Electrical Design, Simulation, and Testing -- chapter 3 ThermoMechanical Design -- chapter 4 Ceramic Materials -- chapter 5 Screen Printing -- chapter 6 Multilayer Ceramics -- chapter 7 Photo-Defined and Photo-Imaged Films -- chapter 8 Copper Interconnects for Ceramic Substrates and Packages -- chapter 9 Integrated Passives in Ceramic Substrates.
Konu Terimleri
:
Electronic ceramics.
Electronic packaging -- Materials.
Interconnects (Integrated circuit technology) -- Design and construction.
Yazar Ek Girişi
:
Barlow, Fred D.
Elshabini, Aicha.
Elektronik Erişim
:
| Kütüphane | Materyal Türü | Demirbaş Numarası | Yer Numarası | [[missing key: search.ChildField.HOLDING]] | Durumu/İade Tarihi |
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| Çevrimiçi Kütüphane | E-Kitap | 539502-1001 | TK7871.15 .C4 C44 2007 | | CRC E-Books |