INTRODUCTION -- Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta -- CHIP METALLIZATION -- Electroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav Datta -- Electroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-Diamand -- Alternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim Bogush -- CHIP-PACKAGE INTERCONNECT -- Tape Carrier and Development Trend, Osamu Yoshika, and Akira Chinda -- Flip-chip Interconnection, Madhav Datta -- Compliant Interconnects, Paul Kohl -- Pb-free Flip-chip Technologies, D. R. Frear, and W.H. Lytle -- PACKAGES AND PC BOARDS -- Materials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay Wakharkar -- Glass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi -- Electrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. Wong -- Bumping Technology for Advanced Packages, Shinichi Wakabayashi -- Plated Through Hole Technology for Boards, Haruo Akahoshi -- PROCESSING TOOLS -- Electroplated Contact Materials for Connectors and Relays, Yutaka Okinaka -- Chemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu Tsujimura -- Electrochemical Deposition Equipment, Tom Ritzdorf, and Dakin Fulton -- Processes and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh.