Electronic Packaging Materials and Their Properties
tarafından
 
Pecht, Michael, author.

Başlık
Electronic Packaging Materials and Their Properties

Yazar
Pecht, Michael, author.

ISBN
9781315214153
 
9781351821353

Basım Bilgisi
First edition.

Fiziksel Tanımlama
1 online resource

Seri
Electronic Packaging

İçerik
chapter Preface -- chapter 1 Properties of electronic packaging materials -- chapter 2 Zeroth-level packaging materials -- chapter 3 First-level packaging materials -- chapter 4 Second-level packaging materials -- chapter 5 Third-level packaging materials -- chapter 6 Summary.

Özet
"Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging."--Provided by publisher.

Konu Terimleri
Electronic Packaging
 
Electromagnetics & Microwaves
 
ARCHIVEnetBASE

Yazar Ek Girişi
Agarwal, Rakish,
 
Dishongh, Terrance J.,
 
Javadpour, Sirus,
 
Mahajan, Rahul,
 
McCluskey, F. Patrick,

Elektronik Erişim
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KütüphaneMateryal TürüDemirbaş NumarasıYer Numarası[[missing key: search.ChildField.HOLDING]]Durumu/İade Tarihi
Çevrimiçi KütüphaneE-Kitap541454-1001TK7870.15 P434 2017CRC E-Books