Electronic Packaging Materials and Their Properties
tarafından
Pecht, Michael, author.
Başlık
:
Electronic Packaging Materials and Their Properties
Yazar
:
Pecht, Michael, author.
ISBN
:
9781315214153
9781351821353
Basım Bilgisi
:
First edition.
Fiziksel Tanımlama
:
1 online resource
Seri
:
Electronic Packaging
İçerik
:
chapter Preface -- chapter 1 Properties of electronic packaging materials -- chapter 2 Zeroth-level packaging materials -- chapter 3 First-level packaging materials -- chapter 4 Second-level packaging materials -- chapter 5 Third-level packaging materials -- chapter 6 Summary.
Özet
:
"Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging."--Provided by publisher.
Konu Terimleri
:
Electronic Packaging
Electromagnetics & Microwaves
ARCHIVEnetBASE
Yazar Ek Girişi
:
Agarwal, Rakish,
Dishongh, Terrance J.,
Javadpour, Sirus,
Mahajan, Rahul,
McCluskey, F. Patrick,
Elektronik Erişim
:
| Kütüphane | Materyal Türü | Demirbaş Numarası | Yer Numarası | [[missing key: search.ChildField.HOLDING]] | Durumu/İade Tarihi |
|---|
| Çevrimiçi Kütüphane | E-Kitap | 541454-1001 | TK7870.15 P434 2017 | | CRC E-Books |