chapter 1 Fundamentals of the Design Process -- chapter 2 Surface Mount Technology -- chapter 3 Integrated Circuit Packages -- chapter 4 Direct Chip Attach -- chapter 5 Circuit Boards -- chapter 6 EMC and Printed Circuit Board Design -- chapter 7 Hybrid Assemblies -- chapter 8 Interconnects -- chapter 9 Design for Test -- chapter 10 Adhesive and Its Application -- chapter 11 Thermal Management -- chapter 12 Testing -- chapter 13 Inspection -- chapter 14 Package/Enclosure -- chapter 15 Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach -- chapter 16 Product Safety and Third-Party Certification.