Thermal and structural electronic packaging analysis for space and extreme environments
tarafından
 
Cepeda-Rizo, Juan, author.

Başlık
: 
Thermal and structural electronic packaging analysis for space and extreme environments

Yazar
: 
Cepeda-Rizo, Juan, author.

ISBN
: 
9781003247005
 
9781000511079
 
9781000511086

Basım Bilgisi
: 
First edition.

Fiziksel Tanımlama
: 
1 online resource.

Seri
: 
Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems

Konu Terimleri
: 
Electronic packaging.
 
Electronic apparatus and appliances -- Reliability.
 
Space vehicles -- Electronic equipment -- Design and construction.
 
Extreme environments.
 
TECHNOLOGY / Engineering / Civil
 
TECHNOLOGY / Engineering / Mechanical

Yazar Ek Girişi
: 
Gayle, Jeremiah,
 
Ravich, Joshua,

Elektronik Erişim
: 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
 
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf


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