Avoiding inelastic strains in solder joint interconnections of IC devices
tarafından
 
Suhir, Ephraim, author.

Başlık
: 
Avoiding inelastic strains in solder joint interconnections of IC devices

Yazar
: 
Suhir, Ephraim, author.

ISBN
: 
9780429460470
 
9780429863820
 
9780429863813
 
9780429863806

Basım Bilgisi
: 
First edition.

Fiziksel Tanımlama
: 
1 online resource : illustrations

Konu Terimleri
: 
Interconnects (Integrated circuit technology) -- Protection.
 
Solder and soldering -- Mechanical properties -- Mathematical models.
 
Failure analysis (Engineering)
 
TECHNOLOGY / Electronics / General
 
TECHNOLOGY / Material Science
 
Electronic books.

Elektronik Erişim
: 
Taylor & Francis https://www.taylorfrancis.com/books/9780429460470
 
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf


KütüphaneMateryal TürüDemirbaş NumarasıYer Numarası[[missing key: search.ChildField.HOLDING]]Durumu/İade Tarihi
Çevrimiçi KütüphaneE-Kitap590345-1001TK7874.53 .S84 2021 EBTaylor Fransic E-Kitap Koleksiyonu