Yazar
Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Kumar, Dhirendra, editor.
Yer Numarası
QK617
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003570257
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Dagur, Arvind, editor. Agarwal, Sohit, editor. Kumar Shukla, Dhirendra, editor. Ali, Shabir, editor. Sharma, Sandhya, editor.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003731689
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Choudhary, Pushpa, editor. Satpathy, Sambit, editor. Dagur, Arvind, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q334
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003593034
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Intelligent Computing and Communication Techniques (2024 : New Delhi, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q334
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003635680
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Intelligent Computing and Communication Techniques (2024 : New Delhi, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q334
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003530176
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Intelligent Computing and Communication Techniques (2024 : New Delhi, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003530190
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Kaur, Sukhpreet. Kamboj, Sushil. Kumar, Manish. Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası
Q183.9
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003561651
Taylor & Francis https://www.taylorfrancis.com/books/9781003501244
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Taylor & Francis https://www.taylorfrancis.com/books/9781003501244
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Kaur, Sukhpreet. Kamboj, Sushil. Kumar, Manish. Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası
Q183.9
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003501244
Taylor & Francis https://www.taylorfrancis.com/books/9781003561651
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Taylor & Francis https://www.taylorfrancis.com/books/9781003561651
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Narayan, Krishna Gopal. author. Sinha, Dharmendra Kumar. author. Singh, Dhirendra Kumar. author. SpringerLink (Online service)
Yer Numarası
ONLINE
Elektronik Erişim
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Artificial Intelligence, Blockchain, Computing and Security (2023 : Greater Noida, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781032684994
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Artificial Intelligence, Blockchain, Computing and Security (2023 : Greater Noida, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003393580
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
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Kopya:
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![ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi](/client/assets/5.0.0.9/ctx//client/images/no_image.png)