Arama Sonuçlarını Sınırlandır
Yazar
SpringerLink (Online service)
(40)
Joshi, Amit. editor.
(9)
Choudrie, Jyoti. editor.
(5)
Perumal, Thinagaran. editor.
(5)
Akashe, Shyam. editor.
(3)
Dil
Yayın Yılı
-
2023
(40)
Konu
Cooperating objects (Computer systems).
(40)
Cyber-Physical Systems.
(40)
Artificial intelligence.
(19)
Internet of things.
(17)
Communications Engineering, Networks.
(16)
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40 sonuç bulundu Arama sonuçlarına abone ol
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13. 
Proceedings of the Second International Conference on Innovations in Computing Research (ICR'23) için kapak resmi
Proceedings of the Second International Conference on Innovations in Computing Research (ICR'23)
Yazar 
Daimi, Kevin. editor. Al Sadoon, Abeer. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35308-6
Format: 
Durum 
Çevrimiçi Kütüphane~1
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14. 
IoT, Big Data and AI for Improving Quality of Everyday Life: Present and Future Challenges IOT, Data Science and Artificial Intelligence Technologies için kapak resmi
IoT, Big Data and AI for Improving Quality of Everyday Life: Present and Future Challenges IOT, Data Science and Artificial Intelligence Technologies
Yazar 
Singh, Pradeep Kumar. editor. Wierzchoń, Sławomir T. editor. Pawłowski, Wiesław. editor. Kar, Arpan Kumar. editor. Kumar, Yugal. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35783-1
Format: 
Durum 
Çevrimiçi Kütüphane~1
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15. 
Artificial Intelligence in IoT and Cyborgization için kapak resmi
Artificial Intelligence in IoT and Cyborgization
Yazar 
Dhanaraj, Rajesh Kumar. editor. Rawal, Bharat S. editor. Krishnamoorthi, Sathya. editor. Balusamy, Balamurugan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-4303-6
Format: 
Durum 
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16. 
Cyber Security Intelligence and Analytics The 5th International Conference on Cyber Security Intelligence and Analytics (CSIA 2023), Volume 2 için kapak resmi
Cyber Security Intelligence and Analytics The 5th International Conference on Cyber Security Intelligence and Analytics (CSIA 2023), Volume 2
Yazar 
Xu, Zheng. editor. Alrabaee, Saed. editor. Loyola-González, Octavio. editor. Cahyani, Niken Dwi Wahyu. editor. Ab Rahman, Nurul Hidayah. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-31775-0
Format: 
Durum 
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17. 
Fundamental and Applied Scientific Research in the Development of Agriculture in the Far East (AFE-2022) Agricultural Cyber-Physical Systems, Volume 2 için kapak resmi
Fundamental and Applied Scientific Research in the Development of Agriculture in the Far East (AFE-2022) Agricultural Cyber-Physical Systems, Volume 2
Yazar 
Zokirjon ugli, Khasanov Sayidjakhon. editor. Muratov, Aleksei. editor. Ignateva, Svetlana. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36960-5
Format: 
Durum 
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18. 
Machine Learning and the Internet of Things in Education Models and Applications için kapak resmi
Machine Learning and the Internet of Things in Education Models and Applications
Yazar 
Idoko, John Bush. editor. Abiyev, Rahib. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42924-8
Format: 
Durum 
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19. 
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 1 için kapak resmi
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 1
Yazar 
Dao, Nhu-Ngoc. editor. Thinh, Tran Ngoc. editor. Nguyen, Ngoc Thanh. editor. (orcid)0000-0002-3247-2948 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-46573-4
Format: 
Durum 
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20. 
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2 için kapak resmi
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2
Yazar 
Dao, Nhu-Ngoc. editor. Thinh, Tran Ngoc. editor. Nguyen, Ngoc Thanh. editor. (orcid)0000-0002-3247-2948 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-46749-3
Format: 
Durum 
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21. 
Proceedings of the International Conference on Internet of Things, Communication and Intelligent Technology için kapak resmi
Proceedings of the International Conference on Internet of Things, Communication and Intelligent Technology
Yazar 
Dong, Jian. editor. Zhang, Long. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-0416-7
Format: 
Durum 
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22. 
Integration of Unmanned Aerial Vehicles in Wireless Communication and Networks UAVs and 5G için kapak resmi
Integration of Unmanned Aerial Vehicles in Wireless Communication and Networks UAVs and 5G
Yazar 
Jayakody, Dushantha Nalin K. editor. Muthuchidambaranathan, P. editor. Dinis, Rui. editor. Panic, Stefan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-03880-8
Format: 
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23. 
Distributed Fault-Tolerant Consensus Control of Leader-Following Systems Based on Adaptive Control Approach için kapak resmi
Distributed Fault-Tolerant Consensus Control of Leader-Following Systems Based on Adaptive Control Approach
Yazar 
Shen, Qikun. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-7426-9
Format: 
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24. 
AI Embedded Assurance for Cyber Systems için kapak resmi
AI Embedded Assurance for Cyber Systems
Yazar 
Wang, Cliff. editor. Iyengar, S.S. editor. Sun, Kun. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42637-7
Format: 
Durum 
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