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SpringerLink (Online service)
(28)
Hong, Wenxing. editor.
(2)
Jan, Mian Ahmad. editor.
(2)
Khan, Fazlullah. editor.
(2)
Weng, Yang. editor.
(2)
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Computational intelligence.
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Engineering and Technology Education.
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Technical education.
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Education.
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Industrial and Production Engineering.
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1. 
Technology and tools in engineering education : research and innovations için kapak resmi
Technology and tools in engineering education : research and innovations
Yazar 
Churi, Prathamesh P., editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003102298
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
STEM the tide reforming science, technology, engineering, and math education in America için kapak resmi
STEM the tide reforming science, technology, engineering, and math education in America
Yazar 
Drew, David E. Project Muse.
Yer Numarası 
ONLINE
Elektronik Erişim 
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3. 
Software Engineering, Business Continuity, and Education International Conferences ASEA, DRBC and EL 2011, Held as Part of the Future Generation Information Technology Conference, FGIT 2011, in Conjunction with GDC 2011, Jeju Island, Korea, December 8-10, 2011. Proceedings için kapak resmi
Software Engineering, Business Continuity, and Education International Conferences ASEA, DRBC and EL 2011, Held as Part of the Future Generation Information Technology Conference, FGIT 2011, in Conjunction with GDC 2011, Jeju Island, Korea, December 8-10, 2011. Proceedings
Yazar 
Kim, Tai-hoon. editor. Adeli, Hojjat. editor. Kim, Haeng-kon. editor. Kang, Heau-jo. editor. Kim, Kyung Jung. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-642-27207-3
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4. 
Fostering Human Development Through Engineering and Technology Education için kapak resmi
Fostering Human Development Through Engineering and Technology Education
Yazar 
Barak, Moshe. editor. Hacker, Michael. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-94-6091-549-9
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5. 
Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan için kapak resmi
Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
Yazar 
International Symposium on Silicon Science (5th : 2009 : Kiryū-shi, Japan) Hanaizumi, Osamu. Unno, Masafumi. Gunma Daigaku. International Education and Research Center for Silicon Science. Gunma Daigaku. Advanced Technology Research Center.
Yer Numarası 
ONLINE
Elektronik Erişim 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=553111
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6. 
Innovations in E-learning, Instruction Technology, Assessment, and Engineering Education için kapak resmi
Innovations in E-learning, Instruction Technology, Assessment, and Engineering Education
Yazar 
Iskander, Magued. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-1-4020-6262-9
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7. 
1st International Conference on Engineering Manufacture 2022 Selected Contributions of EM 2022 için kapak resmi
1st International Conference on Engineering Manufacture 2022 Selected Contributions of EM 2022
Yazar 
da Silva, Lucas F. M. editor. Ravi Kumar, Digavalli. editor. Reis Vaz, Maria de Fátima. editor. Carbas, Ricardo J. C. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-13234-6
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8. 
2nd International Conference on Industrial Applications of Adhesives 2022 Selected Contributions of IAA 2022 için kapak resmi
2nd International Conference on Industrial Applications of Adhesives 2022 Selected Contributions of IAA 2022
Yazar 
da Silva, Lucas F. M. editor. Adams, Robert D. editor. Dilger, Klaus. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-11150-1
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9. 
Application of Big Data, Blockchain, and Internet of Things for Education Informatization Second EAI International Conference, BigIoT-EDU 2022, Virtual Event, July 29-31, 2022, Proceedings, Part I için kapak resmi
Application of Big Data, Blockchain, and Internet of Things for Education Informatization Second EAI International Conference, BigIoT-EDU 2022, Virtual Event, July 29-31, 2022, Proceedings, Part I
Yazar 
Jan, Mian Ahmad. editor. Khan, Fazlullah. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-23950-2
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10. 
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part III için kapak resmi
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part III
Yazar 
Hong, Wenxing. editor. Weng, Yang. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-2449-3
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11. 
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part II için kapak resmi
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part II
Yazar 
Hong, Wenxing. editor. Weng, Yang. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-2446-2
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12. 
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II için kapak resmi
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II
Yazar 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28867-8
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