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13. 
Innovations in ICT: Sustainability for Societal and Industrial Impact Proceedings of 5th International Conference on Data Engineering and Communication Technology (ICDECT 2024), Volume 3 için kapak resmi
Innovations in ICT: Sustainability for Societal and Industrial Impact Proceedings of 5th International Conference on Data Engineering and Communication Technology (ICDECT 2024), Volume 3
Yazar 
Bhateja, Vikrant. editor. Abdul Hameed, Vazeerudeen. editor. Udgata, Siba K. editor. (orcid)0000-0001-8314-2618 Tang, Jinshan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-5220-4
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14. 
The European Smart City Movement Case Studies from Around Europe için kapak resmi
The European Smart City Movement Case Studies from Around Europe
Yazar 
Schachtner, Christian. editor. (orcid)0000-0001-5332-6280 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-96700-9
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15. 
Innovations in Knowledge Mining: Sustainability for Societal and Industrial Impact Proceedings of 5th International Conference on Data Engineering and Communication Technology (ICDECT 2024), Volume 2 için kapak resmi
Innovations in Knowledge Mining: Sustainability for Societal and Industrial Impact Proceedings of 5th International Conference on Data Engineering and Communication Technology (ICDECT 2024), Volume 2
Yazar 
Bhateja, Vikrant. editor. Rana, Muhammad Ehsan. editor. Tripathy, Hrudaya Kumar. editor. (orcid)0000-0002-4960-6228 Senkerik, Roman. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-5217-4
Format: 
Durum 
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16. 
ICT Systems and Sustainability Proceedings of ICT4SD 2024, Volume 1 için kapak resmi
ICT Systems and Sustainability Proceedings of ICT4SD 2024, Volume 1
Yazar 
Tuba, Milan. editor. Akashe, Shyam. editor. Joshi, Amit. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8526-1
Format: 
Durum 
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17. 
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Hardware Architectures için kapak resmi
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Hardware Architectures
Yazar 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-19568-6
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18. 
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges için kapak resmi
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Use Cases and Emerging Challenges
Yazar 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-40677-5
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19. 
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign için kapak resmi
Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing Software Optimizations and Hardware/Software Codesign
Yazar 
Pasricha, Sudeep. editor. Shafique, Muhammad. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-39932-9
Format: 
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20. 
Coupled Structures for Microwave Sensing için kapak resmi
Coupled Structures for Microwave Sensing
Yazar 
Martín, Ferran. editor. Bronchalo, Enrique. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-53861-2
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21. 
Digital Resilience: Navigating Disruption and Safeguarding Data Privacy için kapak resmi
Digital Resilience: Navigating Disruption and Safeguarding Data Privacy
Yazar 
Shandilya, Shishir Kumar. author. (orcid)0000-0002-3308-4445 Datta, Agni. author. Kartik, Yash. author. Nagar, Atulya. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-53290-0
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22. 
MAC Protocol Design in Full-Duplex Enabled Wireless Networks için kapak resmi
MAC Protocol Design in Full-Duplex Enabled Wireless Networks
Yazar 
Fu, Liqun. author. Liu, Shengbo. author. Wu, Wen. author. Zhang, Ning. author. Zhuang, Weihua. author.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-57296-8
Format: 
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23. 
Transforming Industry using Digital Twin Technology için kapak resmi
Transforming Industry using Digital Twin Technology
Yazar 
Mishra, Ashutosh. editor. El Barachi, May. editor. Kumar, Manoj. editor. (orcid)0000-0001-5113-0639 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-58523-4
Format: 
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24. 
Advances in Design, Simulation and Manufacturing VII Proceedings of the 7th International Conference on Design, Simulation, Manufacturing: The Innovation Exchange, DSMIE-2024, June 4-7, 2024, Pilsen, Czech Republic - Volume 1: Manufacturing Engineering için kapak resmi
Advances in Design, Simulation and Manufacturing VII Proceedings of the 7th International Conference on Design, Simulation, Manufacturing: The Innovation Exchange, DSMIE-2024, June 4-7, 2024, Pilsen, Czech Republic - Volume 1: Manufacturing Engineering
Yazar 
Ivanov, Vitalii. editor. (orcid)0000-0003-0595-2660 Trojanowska, Justyna. editor. (orcid)0000-0001-5598-3807 Pavlenko, Ivan. editor. (orcid)0000-0002-6136-1040 Rauch, Erwin. editor. (orcid)0000-0002-2033-4265 Piteľ, Ján. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-61797-3
Format: 
Durum 
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