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Konu: COMPUTERS / Computer Science

Yazar

(2)

Ji, Liang-Wen, editor.

(2)

Lam, Artde Donald Kin-Tak, editor.

(2)

Li, Kenli, author.

(2)

Prior, Stephen D. (Mechanical engineer), editor.

(2)

Rosak-Szyrocka, Joanna, editor.

(2)

Young, Sheng-Joue, editor.

(2)

Agarwal, Shivani, editor.

(1)

Ahad, Mohd Abdul.

(1)

Alam, M. Afshar.

(1)

Alqhatani, Abdulmajeed, editor.

(1)

Ask, Kristine, author.

(1)

Awasthi, Mukesh Kumar, editor.

(1)

Barpanda, Soubhagya Sankar.

(1)

Bowman, Charles F., author.

(1)

Cao, Kun, author. Jinan University, China

(1)

Chavan, Pallavi, editor.

(1)

Cheruku, Ramalingaswamy, author.

(1)

Chowdhary, Chiranji Lal, 1975- editor.

(1)

Cukurova, Mutlu, author.

(1)

Dhatterwal, Jagjit Singh.

(1)

Dillon, Roberto, editor.

(1)

Doss, Srinath, editor.

(1)

Edla, Damodar Reddy, author.

(1)

Evans, Brian J., 1945- author.

(1)

Gao, Song (Geography teacher), editor.

(1)

García Díaz, Vicente, 1981- editor.

(1)

Garg, Pradeep K., editor.

(1)

George, Karine, author.

(1)

Glaser, Henning, editor.

(1)

Gnesi, Stefania, 1954-

(1)

Gupta, Maanak, 1989- editor.

(1)

Gupta, Shashi Kant, editor.

(1)

Henrique, Paulo Sergio Rufino, author.

(1)

Hu, Yingjie, editor.

(1)

IEEE International Conference on Applied System Innovation (6th : 2020 : Taitung, Taiwan), creator.

(1)

International Analytics Conference : (2023 : Hyderabad, India).

(1)

International Conference on Applied System Innovation (7th : 2021 : Alishan, Taiwan) creator.

(1)

International Conference on Artificial Intelligence and Information Technologies (1st : 2023 : Samarkand, Uzbekistan)

(1)

International Conference on Disruptive Technologies in Computing and Communication Systems (1st : 2023)

(1)

International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (2023 : Odisha, India)

(1)

International Conference on Emerging Trends in IoT and Computing Technologies (2023 : Lucknow, India), creator.

(1)

International Conference on Intelligent Computation and Analytics on Sustainable Energy (1st : 2023 : Malda, India), issuing body.

(1)

International Conference on Multidisciplinary Approaches for Sustainable Development in Science & Technology (1st : 2004 : Jaipur, India), sponsoring body.

(1)

International Conference on Recent Advances in Computing Sciences (2nd : 2023 : Jalandhar, India)

(1)

International Conference on Technological Innovations & Applications in Industry 4.0 (2024 : Nagpur, India)

(1)

Karras, Dimitrios A.

(1)

Kaswan, Kuldeep Singh.

(1)

Khan, R. A. (Raees Ahmad), author.

(1)

Khan, Suhel Ahmad, author.

(1)

Khan, Surbhi Bhatia, editor.

(1)

Khari, Manju, editor.

(1)

Knox, Jeremy, author.

(1)

Kolahdooz, Amin, author.

(1)

Kuah, Adrian, editor.

(1)

Kumar, Rajeev, author.

(1)

Kuppili, Venkatanareshbabu, author.

(1)

Le, Dac-Nhuong, 1983- editor.

(1)

Li, Keqin, 1963- author.

(1)

Li, Keqin, author.

(1)

Li, Renfa, author.

(1)

Li, Wenwen, editor.

(1)

Liao, Liefa, author.

(1)

Luckin, Rosemary, author.

(1)

Mahalle, Parikshit N., editor.

(1)

Makkar, Sandhya, editor.

(1)

Mangrulkar, Ramchandra, editor.

(1)

Margaria-Steffen, Tiziana, 1964-

(1)

(1)

Mishra, Ashish (Ashish Kumar), editor.

(1)

Mohan, K. Venkata Murali, editor

(1)

Moshayedi, Ata Jahangir, author.

(1)

Namburu, Anupama.

(1)

Narejo, Ghous Bakhsh, editor.

(1)

Naved, Mohd, editor.

(1)

Nayyar, Anand, editor.

(1)

(1)

Oruganti, Sai Kiran.

(1)

Pal, Souvik, editor.

(1)

Panda, Sanjaya Kumar, editor.

(1)

Patni, Jagdish Chandra, author.

(1)

Phung, Trung-Nghia, editor.

(1)

Prasad, Ramjee, author.

(1)

Prescott, Tony J., author.

(1)

Rajput, Shyam Singh, editor.

(1)

Reddy, C. Kishor Kumar, editor.

(1)

Reddy, Sandeep, editor.

(1)

Saini, Kavita, 1976- editor.

(1)

Sarkar, Mahasweta, editor.

(1)

Seth, Ashish, author.

(1)

(1)

Seth, Kirti, 1966- author.

(1)

Sethi, Srinivas.

(1)

Shakil, Kashish Ara.

(1)

Sharma, Lavanya, editor.

(1)

Sharma, Manmohan.

(1)

Shen, Dong, 1982- author.

(1)

Shen, Siu-Sen, editor.

(1)

Shen, Siu-Tsen, editor.

(1)

Shukla, Dhirendra Kumar.

(1)

Srivastava, Sonal, author.

(1)

Sun, Jin, author. Hanjing University of Science and Technology, China (PR).

(1)

Suresh Babu, M., editor.

(1)

Suseendran, G., editor.

(1)

Swarnkar, Mayank, editor.

(1)

Søraa, Roger Andre, author.

(1)

Thakur, Srinesh.

(1)

Tomar, Ravi, editor.

(1)

Tran, Duc-Tan, editor.

(1)

Tripathi, Anshuman, editor.

(1)

Tripathi, Aprna, author.

(1)

Tripathi, Suman Lata, editor.

(1)

Tripathy, Asis Kumar, editor.

(1)

Wang, Ning (Research scientist), author.

(1)

Williams, Idongesit, editor.

(1)

Williams, James R. (James Richard), 1932-

(1)

Wong, Pindar, editor.

(1)

Xie, Guoqi, 1983- author.

(1)

Yu, Xing Huo, author.

(1)

(1)

Zhang, Jinhui, 1982- author.

(1)

Zhang, Yawen, author.

(1)

Zhou, Junlong, author.

(1)

Żywiołek, Justyna, editor.

(1)

Tümünü genişlet

Dil

(53)

Yayın Yılı

-

(16)

(10)

(9)

(8)

(5)

(4)

(1)

(1)

Tümünü genişlet

Konu

COMPUTERS / Information Technology

(13)

COMPUTERS / Computer Graphics / Game Programming & Design

(8)

COMPUTERS / General

(8)

COMPUTERS / Computer Engineering

(5)

TECHNOLOGY / Manufacturing

(5)

Artificial intelligence.

(4)

COMPUTERS / Machine Theory

(4)

COMPUTERS / Computer Literacy

(3)

COMPUTERS / Hardware / General

(3)

Information technology -- Congresses.

(3)

TECHNOLOGY / Electricity

(3)

TECHNOLOGY / Electronics / General

(3)

Artificial intelligence -- Congresses.

(2)

COMPUTERS / Artificial Intelligence

(2)

COMPUTERS / Data Processing

(2)

COMPUTERS / Data Processing / General

(2)

COMPUTERS / Reference

(2)

Educational technology.

(2)

Industry 4.0 -- Congresses.

(2)

Information technology -- Social aspects.

(2)

Internet of things -- Security measures.

(2)

MATHEMATICS / General

(2)

Medical informatics.

(2)

Medical technology.

(2)

Soft computing.

(2)

Sustainable development -- Congresses.

(2)

TECHNOLOGY / Automation

(2)

TECHNOLOGY / Engineering / General

(2)

TECHNOLOGY / General

(2)

TECHNOLOGY / Industrial Design / General

(2)

TECHNOLOGY / Industrial Health & Safety

(2)

TECHNOLOGY / Material Science

(2)

TECHNOLOGY / Robotics

(2)

Technological innovations -- Congresses.

(2)

Adaptive control systems.

(1)

Agricultural innovations -- Congresses.

(1)

Application software -- Development -- Handbooks, manuals, etc.

(1)

Application software -- Development.

(1)

Artificial intelligence -- Educational applications -- China.

(1)

Artificial intelligence -- Educational applications.

(1)

Artificial intelligence -- Industrial applications.

(1)

Artificial intelligence -- Mathematics.

(1)

Artificial intelligence -- Moral and ethical aspects.

(1)

Artificial intelligence -- Psychological aspects.

(1)

Artificial intelligence -- Social aspects.

(1)

Automatic control -- Safety measures.

(1)

(1)

Automotive computers -- Reliability.

(1)

BUSINESS & ECONOMICS / Development / Sustainable Development

(1)

(1)

Blockchains (Databases)

(1)

Blockchains (Databases) -- Congresses.

(1)

COMPUTERS -- Computer Science.

(1)

COMPUTERS / Bioinformatics

(1)

COMPUTERS / Computer Engineering.

(1)

COMPUTERS / Data Processing / Parallel Processing

(1)

COMPUTERS / Database Management / Data Mining

(1)

COMPUTERS / Database Management / General

(1)

COMPUTERS / Desktop Applications / Desktop Publishing

(1)

COMPUTERS / Programming / Software Development

(1)

COMPUTERS / Security / General

(1)

COMPUTERS / Social Aspects / Human-Computer Interaction

(1)

COVID-19 pandemic -- Economic aspects.

(1)

Cloud computing.

(1)

Component software.

(1)

Computational intelligence.

(1)

Computer networks -- Environmental aspects.

(1)

Computer networks -- Social aspects.

(1)

Computer science -- Congresses.

(1)

Computer security.

(1)

Computer software -- Security measures.

(1)

Computer systems -- Congresses.

(1)

Computer systems.

(1)

Computer-assisted instruction.

(1)

Computers -- Congresses.

(1)

Computers -- Technological innovations -- Congresses.

(1)

Cooperating objects (Computer systems)

(1)

Data protection.

(1)

Diabetes -- Data processing.

(1)

Disruptive technologies -- Congresses.

(1)

Distance education.

(1)

EDUCATION / Computers & Technology

(1)

EDUCATION / Educational Policy & Reform / General

(1)

Education -- Effect of technological innovations on.

(1)

Education and state -- China.

(1)

Education, Higher -- Effect of technological innovations on.

(1)

Electronic apparatus and appliances.

(1)

Electronic books.

(1)

Electronic data processing.

(1)

Electronic digital computers -- Energy conservation.

(1)

Embedded computer systems -- Design and construction.

(1)

Embedded computer systems -- Reliability.

(1)

Energy conservation -- Data processing.

(1)

Engineering -- Study and teaching.

(1)

Engineering experiment stations.

(1)

Fault tolerance (Engineering)

(1)

Fault-tolerant computing.

(1)

Formal methods (Computer science)

(1)

Geospatial data.

(1)

Green technology.

(1)

(1)

Information science.

(1)

Information technology -- Psychological aspects.

(1)

Information technology.

(1)

Intelligent control systems.

(1)

Internet in education.

(1)

Internet in higher education.

(1)

Internet of things -- Congresses.

(1)

Internet of things.

(1)

Intrusion detection systems (Computer security)

(1)

Iterative methods (Mathematics)

(1)

MATHEMATICS / Applied

(1)

MEDICAL / Allied Health Services / Medical Technology

(1)

MEDICAL / Pharmacy

(1)

Machine learning -- Congresses.

(1)

Machine learning.

(1)

Mathematical models.

(1)

Mathematical statistics.

(1)

Medical care -- Technological innovations.

(1)

Medical radiology -- Data processing.

(1)

Medical technology -- Congresses.

(1)

Medicine -- Data processing.

(1)

Microgrids (Smart power grids)

(1)

Microsoft Excel (Computer file)

(1)

PSYCHOLOGY / Cognitive Psychology

(1)

Performance -- Management.

(1)

Persona (Psychoanalysis) -- Data processing.

(1)

Querying (Computer science)

(1)

Radio -- Transmitters and transmission -- Fading.

(1)

Random variables.

(1)

Relational databases.

(1)

Renewable energy sources -- Congresses.

(1)

Research -- Methodology.

(1)

(1)

SCIENCE / Earth Sciences / Geography

(1)

SQL (Computer program language)

(1)

Social change -- Technological innovations.

(1)

Social distancing (Public health) and education.

(1)

(1)

Software architecture.

(1)

Software engineering -- Management.

(1)

Sustainable development.

(1)

Sustainable engineering.

(1)

Sustainable living -- Congresses.

(1)

TECHNOLOGY -- Electronics -- General.

(1)

TECHNOLOGY -- Material Science.

(1)

TECHNOLOGY / Construction / Electrical

(1)

TECHNOLOGY / Electronics / Circuits / General

(1)

TECHNOLOGY / Engineering / Automotive

(1)

TECHNOLOGY / Engineering / Civil

(1)

TECHNOLOGY / Industrial Technology

(1)

TECHNOLOGY / Operations Research

(1)

TECHNOLOGY / Remote Sensing

(1)

TECHNOLOGY / Telecommunications

(1)

Technological innovations -- Social aspects.

(1)

Technological innovations.

(1)

Technology -- Congresses.

(1)

Technology -- Popular works.

(1)

Technology -- Research.

(1)

Telecommunication systems -- Technological innovations -- Congresses.

(1)

(1)

Three-dimensional modeling -- Handbooks, manuals, etc.

(1)

Unity (Electronic resource) -- Handbooks, manuals, etc.

(1)

Virtual reality -- Computer programs -- Handbooks, manuals, etc.

(1)

Web-based instruction.

(1)

Wireless communication systems -- Technological innovations.

(1)

Work -- Technological aspects.

(1)

Workflow management systems.

(1)

Tümünü genişlet

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13.

Development of a remote laboratory for engineering education için kapak resmi

Development of a remote laboratory for engineering education

Development of a remote laboratory for engineering education

Yazar

Wang, Ning (Research scientist), author.

Yer Numarası

TA416

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9780429326455
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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14.

Multidisciplinary Approaches for Sustainable Development için kapak resmi

Multidisciplinary Approaches for Sustainable Development

Multidisciplinary Approaches for Sustainable Development

Yazar

International Conference on Multidisciplinary Approaches for Sustainable Development in Science & Technology (1st : 2004 : Jaipur, India), sponsoring body. Tripathi, Anshuman, editor.

Yer Numarası

HC79 .E5

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003543633
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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15.

Fusion and Integration of Clouds, Edges, and Devices için kapak resmi

Fusion and Integration of Clouds, Edges, and Devices

Fusion and Integration of Clouds, Edges, and Devices

Yazar

Zhou, Junlong, author. Cao, Kun, author. Jinan University, China Sun, Jin, author. Hanjing University of Science and Technology, China (PR). Li, Keqin, author.

Yer Numarası

QA76.585

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003540281
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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16.

INTELLIGENT COMPUTATION AND ANALYTICS ON SUSTAINABLE ENERGY AND ENVIRONMENT proceedings of ICICASEE 2023, GKCIET, Malda, West Bengal. için kapak resmi

INTELLIGENT COMPUTATION AND ANALYTICS ON SUSTAINABLE ENERGY AND ENVIRONMENT proceedings of ICICASEE 2023, GKCIET, Malda, West Bengal.

INTELLIGENT COMPUTATION AND ANALYTICS ON SUSTAINABLE ENERGY AND ENVIRONMENT proceedings of ICICASEE 2023, GKCIET, Malda, West Bengal.

Yazar

International Conference on Intelligent Computation and Analytics on Sustainable Energy (1st : 2023 : Malda, India), issuing body.

Yer Numarası

HC79 .E5

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003540199
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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17.

Governing the Future : Digitalization, Artificial Intelligence, Dataism için kapak resmi

Governing the Future : Digitalization, Artificial Intelligence, Dataism

Governing the Future : Digitalization, Artificial Intelligence, Dataism

Yazar

Glaser, Henning, editor. Wong, Pindar, editor.

Yer Numarası

HC79 .I55

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003226406
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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18.

ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi

ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].

ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].

Yazar

Dagur, Arvind. Shukla, Dhirendra Kumar.

Yer Numarası

Q335

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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19.

Iterative learning control over random fading channels için kapak resmi

Iterative learning control over random fading channels

Iterative learning control over random fading channels

Yazar

Shen, Dong, 1982- author. Yu, Xing Huo, author.

Yer Numarası

TK7867.2

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781032646404
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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20.

The psychology of artificial intelligence için kapak resmi

The psychology of artificial intelligence

The psychology of artificial intelligence

Yazar

Prescott, Tony J., author.

Yer Numarası

Q334.7

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003088660
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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21.

AI FOR RADIOLOGY için kapak resmi

AI FOR RADIOLOGY

AI FOR RADIOLOGY

Yazar

Marques, Oge.

Yer Numarası

R855.3

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003110767
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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22.

Handbook of geospatial artificial intelligence için kapak resmi

Handbook of geospatial artificial intelligence

Handbook of geospatial artificial intelligence

Yazar

Gao, Song (Geography teacher), editor. Hu, Yingjie, editor. Li, Wenwen, editor.

Yer Numarası

G70.217 .G46 H26 2024

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003308423
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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23.

Innovation in the university 4.0 system based on smart technologies için kapak resmi

Innovation in the university 4.0 system based on smart technologies

Innovation in the university 4.0 system based on smart technologies

Yazar

Gupta, Shashi Kant, editor. Rosak-Szyrocka, Joanna, editor.

Yer Numarası

LB1028.43

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003425809
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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24.

TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India için kapak resmi

TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India

TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India

Yazar

International Conference on Technological Innovations & Applications in Industry 4.0 (2024 : Nagpur, India) Seth, Dinesh.

Yer Numarası

T173.8

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003567653
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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