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25. 
Artificial Intelligence in Models, Methods and Applications için kapak resmi
Artificial Intelligence in Models, Methods and Applications
Yazar 
Dolinina, Olga. editor. Bessmertny, Igor. editor. Brovko, Alexander. editor. Kreinovich, Vladik. editor. Pechenkin, Vitaly. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-22938-1
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26. 
Artificial Intelligence and Smart Environment ICAISE'2022 için kapak resmi
Artificial Intelligence and Smart Environment ICAISE'2022
Yazar 
Farhaoui, Yousef. editor. Rocha, Alvaro. editor. Brahmia, Zouhaier. editor. Bhushab, Bharat. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-26254-8
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27. 
Artificial Intelligence for Cyber-Physical Systems Hardening için kapak resmi
Artificial Intelligence for Cyber-Physical Systems Hardening
Yazar 
Traore, Issa. editor. Woungang, Isaac. editor. Saad, Sherif. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-16237-4
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28. 
Artificial General Intelligence 15th International Conference, AGI 2022, Seattle, WA, USA, August 19-22, 2022, Proceedings için kapak resmi
Artificial General Intelligence 15th International Conference, AGI 2022, Seattle, WA, USA, August 19-22, 2022, Proceedings
Yazar 
Goertzel, Ben. editor. Iklé, Matt. editor. Potapov, Alexey. editor. Ponomaryov, Denis. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-19907-3
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29. 
Artificial Intelligence and Soft Computing 21st International Conference, ICAISC 2022, Zakopane, Poland, June 19-23, 2022, Proceedings, Part II için kapak resmi
Artificial Intelligence and Soft Computing 21st International Conference, ICAISC 2022, Zakopane, Poland, June 19-23, 2022, Proceedings, Part II
Yazar 
Rutkowski, Leszek. editor. Scherer, Rafał. editor. Korytkowski, Marcin. editor. Pedrycz, Witold. editor. Tadeusiewicz, Ryszard. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-23480-4
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30. 
Artificial Intelligence and Soft Computing 21st International Conference, ICAISC 2022, Zakopane, Poland, June 19-23, 2022, Proceedings, Part I için kapak resmi
Artificial Intelligence and Soft Computing 21st International Conference, ICAISC 2022, Zakopane, Poland, June 19-23, 2022, Proceedings, Part I
Yazar 
Rutkowski, Leszek. editor. Scherer, Rafał. editor. Korytkowski, Marcin. editor. Pedrycz, Witold. editor. Tadeusiewicz, Ryszard. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-23492-7
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31. 
Modeling Decisions for Artificial Intelligence 20th International Conference, MDAI 2023, Umeå, Sweden, June 19-22, 2023, Proceedings için kapak resmi
Modeling Decisions for Artificial Intelligence 20th International Conference, MDAI 2023, Umeå, Sweden, June 19-22, 2023, Proceedings
Yazar 
Torra, Vicenç. editor. Narukawa, Yasuo. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-33498-6
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32. 
Artificial Intelligence in HCI 4th International Conference, AI-HCI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
Artificial Intelligence in HCI 4th International Conference, AI-HCI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Degen, Helmut. editor. Ntoa, Stavroula. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35894-4
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33. 
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II için kapak resmi
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II
Yazar 
Fujita, Hamido. editor. (orcid) Wang, Yinglin. editor. Xiao, Yanghua. editor. Moonis, Ali. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36822-6
Format: 
Durum 
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34. 
New Frontiers in Artificial Intelligence JSAI-isAI 2021 Workshops, JURISIN, LENLS18, SCIDOCA, Kansei-AI, AI-BIZ, Yokohama, Japan, November 13-15, 2021, Revised Selected Papers için kapak resmi
New Frontiers in Artificial Intelligence JSAI-isAI 2021 Workshops, JURISIN, LENLS18, SCIDOCA, Kansei-AI, AI-BIZ, Yokohama, Japan, November 13-15, 2021, Revised Selected Papers
Yazar 
Yada, Katsutoshi. editor. Takama, Yasufumi. editor. (orcid) Mineshima, Koji. editor. (orcid) Satoh, Ken. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36190-6
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35. 
New Frontiers in Artificial Intelligence JSAI-isAI 2022 Workshop, JURISIN 2022, and JSAI 2022 International Session, Kyoto, Japan, June 12-17, 2022, Revised Selected Papers için kapak resmi
New Frontiers in Artificial Intelligence JSAI-isAI 2022 Workshop, JURISIN 2022, and JSAI 2022 International Session, Kyoto, Japan, June 12-17, 2022, Revised Selected Papers
Yazar 
Takama, Yasufumi. editor. (orcid) Yada, Katsutoshi. editor. Satoh, Ken. editor. (orcid) Arai, Sachiyo. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-29168-5
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36. 
Multi-disciplinary Trends in Artificial Intelligence 16th International Conference, MIWAI 2023, Hyderabad, India, July 21-22, 2023, Proceedings için kapak resmi
Multi-disciplinary Trends in Artificial Intelligence 16th International Conference, MIWAI 2023, Hyderabad, India, July 21-22, 2023, Proceedings
Yazar 
Morusupalli, Raghava. editor. Dandibhotla, Teja Santosh. editor. Atluri, Vani Vathsala. editor. Windridge, David. editor. Lingras, Pawan. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36402-0
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