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25. 
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I için kapak resmi
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Yazar 
Streitz, Norbert A. editor. Konomi, Shin'ichi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34668-2
Format: 
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26. 
Web Services - ICWS 2023 30th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23-26, 2023, Proceedings için kapak resmi
Web Services - ICWS 2023 30th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23-26, 2023, Proceedings
Yazar 
Zhang, Yuchao. editor. Zhang, Liang-Jie. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-44836-2
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27. 
Euro-Par 2022: Parallel Processing Workshops Euro-Par 2022 International Workshops, Glasgow, UK, August 22-26, 2022, Revised Selected Papers için kapak resmi
Euro-Par 2022: Parallel Processing Workshops Euro-Par 2022 International Workshops, Glasgow, UK, August 22-26, 2022, Revised Selected Papers
Yazar 
Singer, Jeremy. editor. Elkhatib, Yehia. editor. Blanco Heras, Dora. editor. Diehl, Patrick. editor. (orcid) Brown, Nick. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-31209-0
Format: 
Durum 
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28. 
Social Computing and Social Media 15th International Conference, SCSM 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I için kapak resmi
Social Computing and Social Media 15th International Conference, SCSM 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Yazar 
Coman, Adela. editor. Vasilache, Simona. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35915-6
Format: 
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29. 
Mobile Web and Intelligent Information Systems 19th International Conference, MobiWIS 2023, Marrakech, Morocco, August 14-16, 2023, Proceedings için kapak resmi
Mobile Web and Intelligent Information Systems 19th International Conference, MobiWIS 2023, Marrakech, Morocco, August 14-16, 2023, Proceedings
Yazar 
Younas, Muhammad. editor. Awan, Irfan. editor. Grønli, Tor-Morten. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-39764-6
Format: 
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30. 
Sentiment Analysis and Deep Learning Proceedings of ICSADL 2022 için kapak resmi
Sentiment Analysis and Deep Learning Proceedings of ICSADL 2022
Yazar 
Shakya, Subarna. editor. Du, Ke-Lin. editor. Ntalianis, Klimis. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-5443-6
Format: 
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31. 
Blockchain for Secure Healthcare Using Internet of Medical Things (IoMT) için kapak resmi
Blockchain for Secure Healthcare Using Internet of Medical Things (IoMT)
Yazar 
Gupta, Sunil. author. Sharma, Hitesh Kumar. author. Kapoor, Monit. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-18896-1
Format: 
Durum 
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32. 
Edge Intelligence From Theory to Practice için kapak resmi
Edge Intelligence From Theory to Practice
Yazar 
Taheri, Javid. author. Dustdar, Schahram. author. Zomaya, Albert. author. Deng, Shuiguang. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-22155-2
Format: 
Durum 
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33. 
Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers için kapak resmi
Analysis, Estimations, and Applications of Embedded Systems 6th IFIP TC 10 International Embedded Systems Symposium, IESS 2019, Friedrichshafen, Germany, September 9-11, 2019, Revised Selected Papers
Yazar 
Wehrmeister, Marco A. editor. Kreutz, Márcio. editor. Götz, Marcelo. editor. Henkler, Stefan. editor. Pimentel, Andy D. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-26500-6
Format: 
Durum 
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34. 
Information Systems 19th European, Mediterranean, and Middle Eastern Conference, EMCIS 2022, Virtual Event, December 21-22, 2022, Proceedings için kapak resmi
Information Systems 19th European, Mediterranean, and Middle Eastern Conference, EMCIS 2022, Virtual Event, December 21-22, 2022, Proceedings
Yazar 
Papadaki, Maria. editor. Rupino da Cunha, Paulo. editor. Themistocleous, Marinos. editor. Christodoulou, Klitos. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-30694-5
Format: 
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35. 
6G Enabled Fog Computing in IoT Applications and Opportunities için kapak resmi
6G Enabled Fog Computing in IoT Applications and Opportunities
Yazar 
Kumar, Mohit. editor. Gill, Sukhpal Singh. editor. Samriya, Jitendra Kumar. editor. Uhlig, Steve. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-30101-8
Format: 
Durum 
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36. 
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings için kapak resmi
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
Yazar 
Jones, Matthew R. editor. Mukherjee, Arunima S. editor. Thapa, Devinder. editor. Zheng, Yingqin. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-50154-8
Format: 
Durum 
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