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97 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Sustainable Energy for Smart Cities 4th EAI International Conference, SESC 2022, Braga, Portugal, November 16-18, 2022, Proceedings için kapak resmi
Sustainable Energy for Smart Cities 4th EAI International Conference, SESC 2022, Braga, Portugal, November 16-18, 2022, Proceedings
Yazar 
Afonso, João L. editor. Monteiro, Vitor. editor. Pinto, José Gabriel. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-33979-0
Format: 
Durum 
Çevrimiçi Kütüphane~1
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2. 
New Media Pedagogy: Research Trends, Methodological Challenges and Successful Implementations First International Conference, NMP 2022, Kraków, Poland, October 10-12, 2022, Revised Selected Papers için kapak resmi
New Media Pedagogy: Research Trends, Methodological Challenges and Successful Implementations First International Conference, NMP 2022, Kraków, Poland, October 10-12, 2022, Revised Selected Papers
Yazar 
Tomczyk, Łukasz. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-44581-1
Format: 
Durum 
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3. 
Learning and Collaboration Technologies 10th International Conference, LCT 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I için kapak resmi
Learning and Collaboration Technologies 10th International Conference, LCT 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Yazar 
Zaphiris, Panayiotis. editor. Ioannou, Andri. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34411-4
Format: 
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4. 
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Streitz, Norbert A. editor. Konomi, Shin'ichi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34609-5
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5. 
Chinese Lexical Semantics 23rd Workshop, CLSW 2022, Virtual Event, May 14-15, 2022, Revised Selected Papers, Part II için kapak resmi
Chinese Lexical Semantics 23rd Workshop, CLSW 2022, Virtual Event, May 14-15, 2022, Revised Selected Papers, Part II
Yazar 
Su, Qi. editor. Xu, Ge. editor. Yang, Xiaoyan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28956-9
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6. 
Text, Speech, and Dialogue 26th International Conference, TSD 2023, Pilsen, Czech Republic, September 4-6, 2023, Proceedings için kapak resmi
Text, Speech, and Dialogue 26th International Conference, TSD 2023, Pilsen, Czech Republic, September 4-6, 2023, Proceedings
Yazar 
Ekštein, Kamil. editor. Pártl, František. editor. Konopík, Miloslav. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-40498-6
Format: 
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7. 
Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings için kapak resmi
Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings
Yazar 
Quaresma, Paulo. editor. Camacho, David. editor. (orcid) Yin, Hujun. editor. (orcid) Gonçalves, Teresa. editor. Julian, Vicente. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-48232-8
Format: 
Durum 
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8. 
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I için kapak resmi
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part I
Yazar 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28787-9
Format: 
Durum 
Çevrimiçi Kütüphane~1
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9. 
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II için kapak resmi
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II
Yazar 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28867-8
Format: 
Durum 
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10. 
Performance Evaluation Methodologies and Tools 15th EAI International Conference, VALUETOOLS 2022, Virtual Event, November 2022, Proceedings için kapak resmi
Performance Evaluation Methodologies and Tools 15th EAI International Conference, VALUETOOLS 2022, Virtual Event, November 2022, Proceedings
Yazar 
Hyytiä, Esa. editor. Kavitha, Veeraruna. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-31234-2
Format: 
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11. 
Perspectives and Trends in Education and Technology Selected Papers from ICITED 2022 için kapak resmi
Perspectives and Trends in Education and Technology Selected Papers from ICITED 2022
Yazar 
Mesquita, Anabela. editor. Abreu, António. editor. (orcid)0000-0001-5958-9188 Carvalho, João Vidal. editor. (orcid)0000-0001-9727-0557 de Mello, Cristina Helena Pinto. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-6585-2
Format: 
Durum 
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12. 
From Industry 4.0 to Industry 5.0 Mapping the Transitions için kapak resmi
From Industry 4.0 to Industry 5.0 Mapping the Transitions
Yazar 
Hamdan, Allam. editor. Harraf, Arezou. editor. Buallay, Amina. editor. Arora, Pallvi. editor. Alsabatin, Hala. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28314-7
Format: 
Durum 
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