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1. 
Advanced Finite Element Simulation with MSC Marc Application of User Subroutines için kapak resmi
Advanced Finite Element Simulation with MSC Marc Application of User Subroutines
Yazar 
Javanbakht, Zia. author. Öchsner, Andreas. author. (orcid)0000-0002-8844-3206 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-47668-1
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2. 
Tests and Proofs 11th International Conference, TAP 2017, Held as Part of STAF 2017, Marburg, Germany, July 19-20, 2017, Proceedings için kapak resmi
Tests and Proofs 11th International Conference, TAP 2017, Held as Part of STAF 2017, Marburg, Germany, July 19-20, 2017, Proceedings
Yazar 
Gabmeyer, Sebastian. editor. Johnsen, Einar Broch. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-61467-0
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3. 
Designing with Computational Intelligence için kapak resmi
Designing with Computational Intelligence
Yazar 
Nedjah, Nadia. editor. (orcid)0000-0002-1656-6397 Lopes, Heitor Silvério. editor. Mourelle, Luiza de Macedo. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-44735-3
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4. 
Hardware Security and Trust Design and Deployment of Integrated Circuits in a Threatened Environment için kapak resmi
Hardware Security and Trust Design and Deployment of Integrated Circuits in a Threatened Environment
Yazar 
Sklavos, Nicolas. editor. Chaves, Ricardo. editor. Di Natale, Giorgio. editor. Regazzoni, Francesco. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-44318-8
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5. 
Discrete Optimization in Architecture Extremely Modular Systems için kapak resmi
Discrete Optimization in Architecture Extremely Modular Systems
Yazar 
Zawidzki, Machi. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-1109-2
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6. 
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9 Proceedings of the 2016 Annual Conference on Experimental and Applied Mechanics  için kapak resmi
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9 Proceedings of the 2016 Annual Conference on Experimental and Applied Mechanics 
Yazar 
Quinn, Simon. editor. Balandraud, Xavier. editor. (orcid)0000-0002-1446-467X SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-42255-8
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7. 
Advances on Mechanics, Design Engineering and Manufacturing Proceedings of the International Joint Conference on Mechanics, Design Engineering & Advanced Manufacturing (JCM 2016), 14-16 September, 2016, Catania, Italy için kapak resmi
Advances on Mechanics, Design Engineering and Manufacturing Proceedings of the International Joint Conference on Mechanics, Design Engineering & Advanced Manufacturing (JCM 2016), 14-16 September, 2016, Catania, Italy
Yazar 
Eynard, Benoit. editor. Nigrelli, Vincenzo. editor. Oliveri, Salvatore Massimo. editor. Peris-Fajarnes, Guillermo. editor. Rizzuti, Sergio. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-45781-9
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8. 
Index Modulation for 5G Wireless Communications için kapak resmi
Index Modulation for 5G Wireless Communications
Yazar 
Wen, Miaowen. author. Cheng, Xiang. author. Yang, Liuqing. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-51355-3
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9. 
Computational Intelligence in Music, Sound, Art and Design 6th International Conference, EvoMUSART 2017, Amsterdam, The Netherlands, April 19-21, 2017, Proceedings için kapak resmi
Computational Intelligence in Music, Sound, Art and Design 6th International Conference, EvoMUSART 2017, Amsterdam, The Netherlands, April 19-21, 2017, Proceedings
Yazar 
Correia, João. editor. Ciesielski, Vic. editor. Liapis, Antonios. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-55750-2
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10. 
Product Lifecycle Management and the Industry of the Future 14th IFIP WG 5.1 International Conference, PLM 2017, Seville, Spain, July 10-12, 2017, Revised Selected Papers için kapak resmi
Product Lifecycle Management and the Industry of the Future 14th IFIP WG 5.1 International Conference, PLM 2017, Seville, Spain, July 10-12, 2017, Revised Selected Papers
Yazar 
Ríos, José. editor. Bernard, Alain. editor. (orcid)0000-0002-7037-2980 Bouras, Abdelaziz. editor. (orcid)0000-0001-5765-1259 Foufou, Sebti. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-72905-3
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11. 
Advances in Production Management Systems. The Path to Intelligent, Collaborative and Sustainable Manufacturing IFIP WG 5.7 International Conference, APMS 2017, Hamburg, Germany, September 3-7, 2017, Proceedings, Part II için kapak resmi
Advances in Production Management Systems. The Path to Intelligent, Collaborative and Sustainable Manufacturing IFIP WG 5.7 International Conference, APMS 2017, Hamburg, Germany, September 3-7, 2017, Proceedings, Part II
Yazar 
Lödding, Hermann. editor. Riedel, Ralph. editor. Thoben, Klaus-Dieter. editor. von Cieminski, Gregor. editor. Kiritsis, Dimitris. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-66926-7
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12. 
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers için kapak resmi
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
Yazar 
Hollstein, Thomas. editor. Raik, Jaan. editor. Kostin, Sergei. editor. Tšertov, Anton. editor. O'Connor, Ian. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-67104-8
Format: 
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