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25. 
AI FOR RADIOLOGY için kapak resmi
AI FOR RADIOLOGY
Yazar 
Marques, Oge.
Yer Numarası 
R855.3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003110767
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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26. 
Handbook of geospatial artificial intelligence için kapak resmi
Handbook of geospatial artificial intelligence
Yazar 
Gao, Song (Geography teacher), editor. Hu, Yingjie, editor. Li, Wenwen, editor.
Yer Numarası 
G70.217 .G46 H26 2024
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003308423
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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27. 
Innovation in the university 4.0 system based on smart technologies için kapak resmi
Innovation in the university 4.0 system based on smart technologies
Yazar 
Gupta, Shashi Kant, editor. Rosak-Szyrocka, Joanna, editor.
Yer Numarası 
LB1028.43
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003425809
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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28. 
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].
Yazar 
Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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29. 
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India için kapak resmi
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India
Yazar 
International Conference on Technological Innovations & Applications in Industry 4.0 (2024 : Nagpur, India) Seth, Dinesh.
Yer Numarası 
T173.8
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003567653
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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30. 
ARTIFICIAL INTELLIGENCE FOR INTRUSION DETECTION SYSTEMS için kapak resmi
ARTIFICIAL INTELLIGENCE FOR INTRUSION DETECTION SYSTEMS
Yazar 
Swarnkar, Mayank, editor. Rajput, Shyam Singh, editor.
Yer Numarası 
TK5105.59
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003346340
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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31. 
Workflow scheduling on computing systems için kapak resmi
Workflow scheduling on computing systems
Yazar 
Li, Kenli, author.
Yer Numarası 
HD62.175
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003307273
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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32. 
Winning together : a UX researcher's guide to building strong cross-functional relationships için kapak resmi
Winning together : a UX researcher's guide to building strong cross-functional relationships
Yazar 
Srivastava, Sonal, author.
Yer Numarası 
Q180.55 .M4
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003391036
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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33. 
Functional safety for embedded systems için kapak resmi
Functional safety for embedded systems
Yazar 
Xie, Guoqi, 1983- author. Zhang, Yawen, author. Li, Renfa, author. Li, Kenli, author. Li, Keqin, 1963- author.
Yer Numarası 
TK7895 .E42
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003391517
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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34. 
AI and education in China : imagining the future, excavating the past için kapak resmi
AI and education in China : imagining the future, excavating the past
Yazar 
Knox, Jeremy, author.
Yer Numarası 
LB1028.3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003375135
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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35. 
Digitalization and social change : a guide in critical thinking için kapak resmi
Digitalization and social change : a guide in critical thinking
Yazar 
Ask, Kristine, author. Søraa, Roger Andre, author.
Yer Numarası 
HM851
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003289555
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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36. 
Advances in distance learning in times of pandemic için kapak resmi
Advances in distance learning in times of pandemic
Yazar 
Rosak-Szyrocka, Joanna, editor. Żywiołek, Justyna, editor. Nayyar, Anand, editor. Naved, Mohd, editor.
Yer Numarası 
LB1044.87
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003322252
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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