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25. 
Nanotechnology horizons in food process engineering, Volume 1 : Food preservation, food packaging and sustainable agriculture için kapak resmi
Nanotechnology horizons in food process engineering, Volume 1 : Food preservation, food packaging and sustainable agriculture
Yazar 
Goyal, Megh R., editor. Malik, Junaid Ahmad, 1987- editor. Kumar, Satish (Lecturer in food science and technology), editor. Watharkar, Ritesh B., editor.
Yer Numarası 
TP248.65 .F66
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003305378
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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26. 
Micro and nanotechnologies in engineering stem cells and tissues için kapak resmi
Micro and nanotechnologies in engineering stem cells and tissues
Yazar 
Ramalingam, Murugan. Institute of Electrical and Electronics Engineers.
Yer Numarası 
ONLINE
Elektronik Erişim 
Wiley Online Library
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27. 
Biogenic-based metal nanomaterials for sustainable engineering applications için kapak resmi
Biogenic-based metal nanomaterials for sustainable engineering applications
Yazar 
Kulkarni, Shrikaant, editor Akolkar, Hemantkumar, 1986- Khedkar, Vijay, 1983- editor. Ramasamy, Rajesh (Head of the Department of Pathology in the Faculty of Medicine and Health Sciences & Teaching Hospital), editor. Mahanwar, Kirti R., editor.
Yer Numarası 
R856.15
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781998511792
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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28. 
Handbook of research on nano-drug delivery and tissue engineering : guide to strengthening healthcare systems için kapak resmi
Handbook of research on nano-drug delivery and tissue engineering : guide to strengthening healthcare systems
Yazar 
Rajendran, Rajakumari, edtior. Maria, Hanna J., editor. Thomas, Sabu, editor. Kalarikkal, Nandakumar, editor.
Yer Numarası 
R857 .N34
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003161196
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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29. 
Gigantic challenges, nano solutions : the science and engineering of nanoscale systems için kapak resmi
Gigantic challenges, nano solutions : the science and engineering of nanoscale systems
Yazar 
Amer, Maher S., author.
Yer Numarası 
T174.7
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003147046
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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30. 
Micro and Nano Machining of Engineering Materials Recent Developments için kapak resmi
Micro and Nano Machining of Engineering Materials Recent Developments
Yazar 
Kumar, Kaushik. editor. (orcid)0000-0002-4237-2836 Zindani, Divya. editor. (orcid)0000-0002-9941-593X Kumari, Nisha. editor. Davim, J. Paulo. editor. (orcid)0000-0002-5659-3111 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-99900-5
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31. 
Innovation in Materials Science and Engineering Proceedings of ICEMIT 2017, Volume 2 için kapak resmi
Innovation in Materials Science and Engineering Proceedings of ICEMIT 2017, Volume 2
Yazar 
Chattopadhyay, Jayeeta. editor. Singh, Rahul. editor. Prakash, Om. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-13-2944-9
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32. 
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016 için kapak resmi
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Yazar 
Bhattacharyya, Swapan. editor. Sen, Sabyasachi. editor. Dutta, Meghamala. editor. Biswas, Papun. editor. Chattopadhyay, Himadri. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-3953-9
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33. 
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method için kapak resmi
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Yazar 
Seok, Seonho. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-77872-3
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34. 
Glancing angle deposition of thin films : engineering the nanoscale için kapak resmi
Glancing angle deposition of thin films : engineering the nanoscale
Yazar 
Hawkeye, Matthew M., author. Taschuk, Michael T., author. Brett, Michael J., author.
Yer Numarası 
ONLINE(341883.1)
Elektronik Erişim 
John Wiley http://dx.doi.org/10.1002/9781118847510
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35. 
MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development için kapak resmi
MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development
Yazar 
Ortloff, Dirk. author. Schmidt, Thilo. author. Hahn, Kai. author. Bieniek, Tomasz. author. Janczyk, Grzegorz. author.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-7091-0706-5
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36. 
Surface Tension in Microsystems Engineering Below the Capillary Length için kapak resmi
Surface Tension in Microsystems Engineering Below the Capillary Length
Yazar 
Lambert, Pierre. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE(334451.1)
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-642-37552-1
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