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SpringerLink (Online service)

(17)

Wiley InterScience (Online service)

(5)

Gross, Dietmar. author.

(3)

Seelig, Thomas. author.

(3)

Hausselt, Jürgen.

(2)

(2)

Michler, Goerg H. (Goerg Hannes)

(2)

Wang, Linbing, 1963-

(2)

(1)

Aboudi, Jacob, 1935-

(1)

American Society of Civil Engineers.

(1)

Ananthasuresh, Gondi Kondaiah. editor.

(1)

Annual Congress on Advanced Engineering and Technology (CAET) (2014 : Hong Kong). author.

(1)

(1)

Auberton-Herv�, A. J., e

(1)

Bai, Y. L. editor.

(1)

Baidyk, Tatiana. author.

(1)

Balta-Calleja, F. J.

(1)

Baltá-Calleja, F. J.

(1)

Bednarcyk, Brett A.

(1)

Berg, A. van den (Albert)

(1)

Berlin, Charles I., ed.

(1)

Beskok, Ali, 1966- ort. yaz.

(1)

Blackwell, Glenn R.

(1)

Bobbin, Richard P., ed.

(1)

Butcher, Cliff. author.

(1)

Cambou, Bernard.

(1)

Chau, Kam-Tim. editor.

(1)

Chen, Y. Y. (Yiyi)

(1)

Chen, Zengtao. author.

(1)

Cherkaoui, Mohammed.

(1)

Corves, Burkhard. editor.

(1)

(1)

Dvorak, George. author.

(1)

(1)

GeoShanghai International Conference (2010)

(1)

Ghiocel, Dan M.

(1)

Huang, Dianjian, editor.

(1)

(1)

Institute of Electrical and Electronics Engineers.

(1)

International Conference on Modelling and Computation in Engineering (2010 : Hong Kong, China)

(1)

International Symposium on Tubular Structures (12th : 2008 : Shanghai)

(1)

Iyer, S. S., ed.

(1)

Jean, Michel, 1940-

(1)

Jones, Robert M., author.

(1)

Kachanov, Mark. author.

(1)

Kandlikar, S. G. (Satish G.)

(1)

Karniadakis, George.

(1)

Kishore Kumar, S. editor.

(1)

Kondo, Djimédo.

(1)

Krajcinovic, Dusan.

(1)

Kussul, Ernst. author.

(1)

(1)

(1)

Meguid, Shaker A. editor.

(1)

Meier, Roger (Roger W.)

(1)

Meyers, Marc A.

(1)

Mishnaevsky, L. (Leon)

(1)

Mishnaevsky, Leon. author.

(1)

Nait-Abdelaziz, Moussa.

(1)

Nikolaidis, Efstratios.

(1)

Oosterbroek, R. Edwin.

(1)

Petuya, Victor. editor.

(1)

(1)

(1)

Radjaï, Farhang.

(1)

Raghunandan, B. N. editor.

(1)

Schmauder, Siegfried. author.

(1)

Sevostianov, Igor. author.

(1)

Shen, Z. Y. (Zu-yan)

(1)

Sih, G. C. (George C.)

(1)

Singhal, Suren.

(1)

Sivaramakrishna, Gullapalli. editor.

(1)

Stupkiewicz, Stanisław. author.

(1)

Tai-Ran Hsu, ed.

(1)

Titterton, David

(1)

Totten, George E.

(1)

(1)

Ulm, F.-J. (Franz-Josef)

(1)

Voyiadjis, George Z. author.

(1)

Voyiadjis, George Z. editor.

(1)

Vu-Khanh, Toan.

(1)

Wei, Y. G. editor.

(1)

Weng, George J. editor.

(1)

(1)

Wriggers, Peter. editor.

(1)

Wunsch, Donald C. author.

(1)

Xie, Liquan, 1972- editor.

(1)

Zetterling, Carl-Mikael, ed.

(1)

Zhao, Jidong. editor.

(1)

Zhao, X. Z. (Xianzhong)

(1)

Zheng, Q. S. editor.

(1)

(1)

Zohdi, Tarek I. editor.

(1)

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Dil

(49)

Yayın Yılı

-

(5)

(4)

(4)

(4)

(4)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Micromechanics.

(16)

(9)

(8)

(8)

Surfaces (Physics).

(7)

Mechanical engineering.

(5)

Mechanics, Applied.

(4)

Computer science.

(3)

Engineering design.

(3)

Nanotechnology.

(3)

(2)

Aerospace engineering.

(2)

(2)

Ceramic materials -- Microstructure.

(2)

Composite materials.

(2)

Continuum Mechanics and Mechanics of Materials.

(2)

Deformations (Mechanics)

(2)

Electronic books.

(2)

Metals -- Microstructure.

(2)

Micromechanics -- Mathematical models.

(2)

Microtechnology.

(2)

Aerospace Technology and Astronautics.

(1)

Analytical biochemistry.

(1)

Artificial intelligence.

(1)

Asphalt -- Mechanical properties.

(1)

Asphalt -- Microstructure.

(1)

(1)

Building materials.

(1)

Capteurs (technologie)

(1)

Ceramic materials.

(1)

Ceramics, Glass, Composites, Natural Methods.

(1)

(1)

Characterization and Evaluation of Materials.

(1)

Chemical detectors.

(1)

Classical Mechanics.

(1)

Composite materials -- Mechanical properties -- Mathematical models.

(1)

(1)

Computer vision.

(1)

Condensed matter.

(1)

Continuum damage mechanics.

(1)

Continuum mechanics -- Congresses.

(1)

(1)

(1)

(1)

(1)

Diodes, Schottky-barrier.

(1)

Dispositifs électromécaniques.

(1)

Electric resistance.

(1)

Electroacoustic transducers.

(1)

Electronic apparatus and appliances.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging.

(1)

(1)

Engine Technology.

(1)

Engineering -- Congresses.

(1)

Engineering -- Data processing -- Congresses.

(1)

Engineering -- Mathematical models -- Congresses.

(1)

Engineering Mechanics.

(1)

Engineering Thermodynamics, Heat and Mass Transfer.

(1)

(1)

(1)

(1)

Fluid mechanics.

(1)

Fluidic devices.

(1)

Fracture mechanics -- Congresses.

(1)

(1)

Geotechnical Engineering and Applied Earth Sciences.

(1)

Geotechnical engineering.

(1)

Granular materials -- Mechanical properties.

(1)

Granular materials -- Microstructure.

(1)

Grinding and polishing.

(1)

Hair Cells -- physiology.

(1)

Heat -- Transmission.

(1)

Heat engineering.

(1)

Heat exchangers -- Fluid dynamics.

(1)

Heat exchangers.

(1)

(1)

Inertial navigation.

(1)

Injection molding of ceramics.

(1)

Injection molding of metals.

(1)

Integrated circuits--Very large scale integration.

(1)

Ion implantation.

(1)

KIL HÜCRELERİ -- FİZYOLOJİ.

(1)

(1)

(1)

Materials Science

(1)

Materials science -- Simulation methods.

(1)

Materials science.

(1)

(1)

(1)

Mechanical wear.

(1)

(1)

Mechanics, applied.

(1)

Mechanische Eigenschaft.

(1)

Metaller -- Mikroyapı.

(1)

Microchemistry -- Equipment and supplies.

(1)

Microchemistry -- Equipment and supplies. Fluidic devices. Micromechanics. Analytical biochemistry.

(1)

Microelectromechanical systems -- Materials -- Textbooks.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics -- Mathematical models -- Congresses.

(1)

Micromechanics -- Textbooks.

(1)

Micromécanique.

(1)

Microprocessors.

(1)

Microstructure -- Congresses.

(1)

Microstructure -- Mathematical models.

(1)

Microstructure.

(1)

(1)

(1)

Mikroteknoloji.

(1)

MİKROMEKANİK.

(1)

Nanostructured materials -- Mechanical properties -- Textbooks.

(1)

Nanostructured materials.

(1)

(1)

Numerical analysis.

(1)

Offshore Engineering.

(1)

Offshore structures.

(1)

Ohmic contacts.

(1)

Optical pattern recognition.

(1)

(1)

(1)

(1)

Polymers -- Mechanical properties.

(1)

Polymers -- Microstructure.

(1)

(1)

Porous materials -- Mechanical properties -- Mathematical models.

(1)

Porous materials -- Mechanical properties.

(1)

Power semiconductors.

(1)

Reliability (Engineering)

(1)

SIVI MEKANİĞİ.

(1)

Sealing (Technology).

(1)

Semiconductor wafers.

(1)

Semiconductors--Junctions.

(1)

Semiconductors.

(1)

Seramik gereçler -- Mikroyapı.

(1)

Silicon compounds.

(1)

Silicon-on-insulator technology.

(1)

(1)

Soil mechanics -- Congresses.

(1)

Soil micromorphology -- Congresses.

(1)

Solid Mechanics.

(1)

(1)

Structural Materials.

(1)

Surfaces (Technology)

(1)

Technology -- Congresses.

(1)

Telecommunication.

(1)

Temperature measuring instruments.

(1)

Thermodynamics.

(1)

(1)

Tubular steel structures -- Congresses.

(1)

(1)

Wide gap semiconductors.

(1)

Tümünü genişlet

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37.

Mechanical properties of polymers based on nanostructure and morphology için kapak resmi

Mechanical properties of polymers based on nanostructure and morphology

Mechanical properties of polymers based on nanostructure and morphology

Yazar

Michler, Goerg H. (Goerg Hannes) Balta-Calleja, F. J.

Yer Numarası

TA418.9 .C6 M397 2005

Elektronik Erişim

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38.

Microengineering of metals and ceramics için kapak resmi

Microengineering of metals and ceramics

Microengineering of metals and ceramics

Yazar

Löhe, Detlef. Hausselt, Jürgen.

Yer Numarası

QC176.8.M5 M53 2005 V.4/PT.2

Format:

Durum

Beytepe Kütüphanesi~2

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39.

Microengineering of metals and ceramics için kapak resmi

Microengineering of metals and ceramics

Microengineering of metals and ceramics

Yazar

Löhe, Detlef. Hausselt, Jürgen. Wiley InterScience (Online service)

Yer Numarası

ONLINE

Elektronik Erişim

An electronic book accessible through the World Wide Web; click for information
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0627/2005283916-b.html
John Wiley http://dx.doi.org/10.1002/9783527616725

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40.

MEMS Packaging için kapak resmi

Yazar

Tai-Ran Hsu, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP003E

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41.

Strapdown Inertial Navigation Technology için kapak resmi

Strapdown Inertial Navigation Technology

Strapdown Inertial Navigation Technology

Yazar

Titterton, David Weston, John

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBRA017E

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42.

Mechanical tribology : materials, characterization, and applications için kapak resmi

Mechanical tribology : materials, characterization, and applications

Mechanical tribology : materials, characterization, and applications

Yazar

Totten, George E. Liang, Hong.

Yer Numarası

TJ1075 .M43 2004

Elektronik Erişim

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43.

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis için kapak resmi

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Yazar

Oosterbroek, R. Edwin. Berg, A. van den (Albert)

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780444511003

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44.

Silicon Wafer Bonding Technology for VLSI and MEMS Applications için kapak resmi

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Yazar

Iyer, S. S., ed. Auberton-Herv�, A. J., e

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP001E

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45.

Process Technology for Silicon Carbide Devices için kapak resmi

Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Yazar

Zetterling, Carl-Mikael, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP002E

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46.

Micro flows : fundamentals and simulation için kapak resmi

Micro flows : fundamentals and simulation

Micro flows : fundamentals and simulation

Yazar

Karniadakis, George. Beskok, Ali, 1966- ort. yaz.

Yer Numarası

TA 357 K36 2002

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47.

The electronic packaging handbook için kapak resmi

The electronic packaging handbook

The electronic packaging handbook

Yazar

Blackwell, Glenn R.

Yer Numarası

TK7870.15 .E4233 2000

Elektronik Erişim

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48.

Computational materials science the simulation of materials microstructures and properties için kapak resmi

Computational materials science the simulation of materials microstructures and properties

Computational materials science the simulation of materials microstructures and properties

Yazar

Raabe, Dierk.

Yer Numarası

ONLINE

Elektronik Erişim

Click here to see page images available via Wiley.
John Wiley http://dx.doi.org/10.1002/3527601945
HathiTrust Digital Library Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/40821147.html

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