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1. 
FORMAL METHODS FOR MANAGING AND PROCESSING ONTOLOGY ALIGNMENTS için kapak resmi
FORMAL METHODS FOR MANAGING AND PROCESSING ONTOLOGY ALIGNMENTS
Yazar 
Pietranik, Marcin.
Yer Numarası 
Q387.4 .P54 2024
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003437888
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Research tendencies and prospect domains for AI development and implementation için kapak resmi
Research tendencies and prospect domains for AI development and implementation
Yazar 
Kondratenko, Yuriy P., editor. Shevchenko, Anatolii I., editor.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9788770046947
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
MUSE OF CODING computer programming as art. için kapak resmi
MUSE OF CODING computer programming as art.
Yazar 
Garfinkle, Richard.
Yer Numarası 
QA76.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003459866
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Quantum artificial intelligence with Qiskit. için kapak resmi
Quantum artificial intelligence with Qiskit.
Yazar 
Wichert, Andrzej, author.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003374404
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India için kapak resmi
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India
Yazar 
International Conference on Technological Innovations & Applications in Industry 4.0 (2024 : Nagpur, India) Seth, Dinesh.
Yer Numarası 
T173.8
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003567653
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Multifaceted approaches for data acquisition processing and communication için kapak resmi
Multifaceted approaches for data acquisition processing and communication
Yazar 
Chakraborty, Chinmay, 1984- editor.
Yer Numarası 
QA76.9 .D32
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003470939
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
RECENT ADVANCES IN COMPUTING SCIENCES proceedings of the 2nd International Conference on Recent Advances in Computing Sciences (RACS, 2023). için kapak resmi
RECENT ADVANCES IN COMPUTING SCIENCES proceedings of the 2nd International Conference on Recent Advances in Computing Sciences (RACS, 2023).
Yazar 
International Conference on Recent Advances in Computing Sciences (2nd : 2023 : Jalandhar, India) Sharma, Manmohan.
Yer Numarası 
QA75.5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003570349
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India için kapak resmi
Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India
Yazar 
International Conference on Intelligent Circuits and Systems (2023 : New Delhi, India), issuing body. Dharman, Bhaveshkumar Choithram, editor. Tripathi, Suman Lata, editor.
Yer Numarası 
TK7874
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003521716
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Digital transformation with AI and smart servicing technologies for sustainable rural development için kapak resmi
Digital transformation with AI and smart servicing technologies for sustainable rural development
Yazar 
Qin, Shengfeng, editor. Wang, Hongan, editor. Ma, Cuixia, editor.
Yer Numarası 
GE45 .D37 .D54 2024 EB
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032686691
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
DEEP LEARNING FOR MULTIMEDIA PROCESSING APPLICATIONS. VOLUME ONE, Image security and intelligent systems for multimedia processing için kapak resmi
DEEP LEARNING FOR MULTIMEDIA PROCESSING APPLICATIONS. VOLUME ONE, Image security and intelligent systems for multimedia processing
Yazar 
Bhatti, Uzair Aslam. Mengxing, Huang. Li, Jingbing. Bazai, Sibghat Ullah. Aamir, Muhammad.
Yer Numarası 
QA76.575
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003427674
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
IOT, MACHINE LEARNING AND DATA ANALYTICS FOR SMART HEALTHCARE için kapak resmi
IOT, MACHINE LEARNING AND DATA ANALYTICS FOR SMART HEALTHCARE
Yazar 
Azrour, Mourade. Mabrouki, Jamal. Guezzaz, Azidine. Ahmad, Sultan. Khan, Shakir.
Yer Numarası 
R858
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003430735
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
AI FOR RADIOLOGY için kapak resmi
AI FOR RADIOLOGY
Yazar 
Marques, Oge.
Yer Numarası 
R855.3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003110767
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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