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1. 
CATIA V5 practical studies using finite element analysis. için kapak resmi
CATIA V5 practical studies using finite element analysis.
Yazar 
Ghionea, Ionuţ Gabriel, author.
Yer Numarası 
TL253
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003426813
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
RECENT ADVANCES IN COMPUTING SCIENCES proceedings of the 2nd International Conference on Recent Advances in Computing Sciences (RACS, 2023). için kapak resmi
RECENT ADVANCES IN COMPUTING SCIENCES proceedings of the 2nd International Conference on Recent Advances in Computing Sciences (RACS, 2023).
Yazar 
International Conference on Recent Advances in Computing Sciences (2nd : 2023 : Jalandhar, India) Sharma, Manmohan.
Yer Numarası 
QA75.5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003570349
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Recent Advances in Science, Engineering and Technology (RASET-2023) : proceedings of the International Conference on Recent Advances in Science, Engineering & Technology, 29-30 September 2023 için kapak resmi
Recent Advances in Science, Engineering and Technology (RASET-2023) : proceedings of the International Conference on Recent Advances in Science, Engineering & Technology, 29-30 September 2023
Yazar 
International Conference on Recent Advances in Science, Engineering & Technology (2023), issuing body. Gupta, Nishu, editor.
Yer Numarası 
T173.8
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003527442
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
IPv6 network slicing : offering new experience for industries için kapak resmi
IPv6 network slicing : offering new experience for industries
Yazar 
Li, Zhenbin, author. Dong, Jie, author. Zhang, Yawei, author. Zeng, Xinzong, author.
Yer Numarası 
TK5105.585
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032699868
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India. için kapak resmi
INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India.
Yazar 
International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (2023 : Odisha, India) Sethi, Srinivas.
Yer Numarası 
T59.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003450924
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
SECURITY, PRIVACY, AND TRUST IN WBANS AND E HEALTHCARE için kapak resmi
SECURITY, PRIVACY, AND TRUST IN WBANS AND E HEALTHCARE
Yazar 
Singh, Anuj Kumar. Kumar, Sachin (Computer scientist)
Yer Numarası 
QA76.9 .A25
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032635101
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Emerging electrical and computer technologies for smart cities : modelling, solution techniques and applications için kapak resmi
Emerging electrical and computer technologies for smart cities : modelling, solution techniques and applications
Yazar 
Mahela, Om Prakash, 1977- editor. Khan, Baseem, 1987- editor. Jain, Puneet Kumar, editor.
Yer Numarası 
TD159.4
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003486930
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India için kapak resmi
TECHNOLOGICAL INNOVATIONS & APPLICATIONS IN INDUSTRY 4.0 Proceedings of the International Conference on Technological Innovations & Applications in Industry 4.0: Challenges and Way Ahead, (ICTIA-2024), 24th to 25th April, 2024 Nagpur, India
Yazar 
International Conference on Technological Innovations & Applications in Industry 4.0 (2024 : Nagpur, India) Seth, Dinesh.
Yer Numarası 
T173.8
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003567653
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Intelligent Security Solutions for Cyber-Physical Systems için kapak resmi
Intelligent Security Solutions for Cyber-Physical Systems
Yazar 
Sood, Vandana Mohindru, editor. Singh, Yashwant, editor. Bhargava, Bharat, editor. Narang, Sushil Kumar, editor.
Yer Numarası 
QA76.9 .A25
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003406105
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
Computational science and its applications için kapak resmi
Computational science and its applications
Yazar 
Pankaj, Anupama, editor. Sharma, Sachin, editor. Arora, Vasudha, editor.
Yer Numarası 
Q342
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003347484
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Handbook of research on artificial intelligence and soft computing techniques in personalized healthcare services için kapak resmi
Handbook of research on artificial intelligence and soft computing techniques in personalized healthcare services
Yazar 
Dulhare, Uma N., editor. Senthil Kumar, A. V., 1966- editor. Dutta, Amit, 1971- editor. Bri, Seddik, 1968- editor. El Emary, Ibrahiem M. M., editor.
Yer Numarası 
R859.7 .A78
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003371250
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
SOFT COMPUTING engineering applications. için kapak resmi
SOFT COMPUTING engineering applications.
Yazar 
Debnath, Pradip. Tripathy, Binod Chandra.
Yer Numarası 
QA76.9 .S63
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003466260
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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