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26 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Integration of Reusable Systems için kapak resmi
Integration of Reusable Systems
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-04717-1
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2. 
Formalisms for Reuse and Systems Integration için kapak resmi
Formalisms for Reuse and Systems Integration
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-16577-6
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3. 
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment için kapak resmi
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment
Yazar 
Kumar, Arun (Associate professor of electronics), editor. Chakravarty, Sumit (Associate professor of electrical engineering), editor. Aravinda, K., 1966- editor. Sharma, Mohit Kumar (Assistant professor), editor.
Yer Numarası 
RA971.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003403678
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS için kapak resmi
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS
Yazar 
Bhambri, Pankaj. Rani, Sita. Balas, Valentina Emilia. Elngar, Ahmed A.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003383505
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
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5. 
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers için kapak resmi
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers
Yazar 
Bombieri, Nicola. editor. Pravadelli, Graziano. editor. Fujita, Masahiro. editor. Austin, Todd. editor. Reis, Ricardo. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-23425-6
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6. 
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers için kapak resmi
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers
Yazar 
Woon, Wei Lee. editor. Aung, Zeyar. editor. Catalina Feliú, Alejandro. editor. Madnick, Stuart. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-04303-2
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7. 
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems için kapak resmi
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Yazar 
Papa, Umberto. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-73174-2
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8. 
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008 için kapak resmi
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Yazar 
Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-540-89859-7
Format: 
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9. 
Methods and applications of artificial intelligence : dynamic response, learning, random forest, linear regression, interoperability, additive manufacturing and mechatronics için kapak resmi
Methods and applications of artificial intelligence : dynamic response, learning, random forest, linear regression, interoperability, additive manufacturing and mechatronics
Yazar 
El Hami, Abdelkhalak, editor.
Yer Numarası 
Q335 .M48 2025
Elektronik Erişim 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394351817
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10. 
Cyber-physical systems for innovating and transforming society 5.0 için kapak resmi
Cyber-physical systems for innovating and transforming society 5.0
Yer Numarası 
T14.5 .C93 2025
Elektronik Erişim 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394197750
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11. 
Smart cyber-physical power systems : fundamental concepts, challenges, and solutions. Volume 1 için kapak resmi
Smart cyber-physical power systems : fundamental concepts, challenges, and solutions. Volume 1
Yazar 
Parizad, Ali, editor. Baghaee, Hamid Reza, editor. Rahman, Saifur, editor.
Yer Numarası 
TJ213 .S485 2025
Elektronik Erişim 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394191529
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12. 
Artificial intelligence in remote sensing for disaster management için kapak resmi
Artificial intelligence in remote sensing for disaster management
Yazar 
Dahiya, Neelam, editor. Singh, Gurwinder, editor. Singh, Sartajvir, editor. Sharma, Apoorva, editor.
Yer Numarası 
HD49 .A78 2025
Elektronik Erişim 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394287222
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