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Konu: Electronic packaging.

Yazar

Greenhouse, Hal.

(2)

Avtgis, Alexander W.

(1)

Del Castillo, Enrique.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961-

(1)

Lee, Ning-Cheng.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Megow, William F.

(1)

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Villanucci, Robert S., 1944-

(1)

Tümünü genişlet

Dil

(15)

Yayın Yılı

-

(3)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Electronic apparatus and appliances -- Design and construction.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronics -- Materials -- Permeability.

(2)

Sealing (Technology)

(2)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

(1)

(1)

Dichtung (Technik)

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic books.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Environmental protection.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Microelectromechanical systems.

(1)

Microelectronic packaging.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mixing circuits.

(1)

Nanostructured materials.

(1)

Optoelectronic devices.

(1)

Oscillators, Electric.

(1)

Passive components.

(1)

Production management.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Telecommunication.

(1)

Tümünü genişlet

Materyal Türü

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1.

Electronic enclosures, housings and packages için kapak resmi

Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Yazar

Süli, Frank, author.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

Format:

Durum

Çevrimiçi Kütüphane~1

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2.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

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3.

LED packaging for lighting applications design, manufacturing, and testing için kapak resmi

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Yazar

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Yer Numarası

ONLINE

Elektronik Erişim

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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4.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

Subscription required

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5.

Practical guide to the packaging of electronics thermal and mechanical design and analysis için kapak resmi

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Yazar

Jamnia, Ali, 1961-

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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6.

Adhesives technology for electronic applications materials, processes, reliability için kapak resmi

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Yazar

Licari, James J., 1930- Swanson, Dale W.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

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7.

Lead-free soldering in electronics science, technology and environmental impact için kapak resmi

Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Yazar

Suganuma, Katsuaki.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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8.

Handbook of lead-free solder technology for microelectronic assemblies için kapak resmi

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Yazar

Puttlitz, Karl J. Stalter, Kathleen A.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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9.

MEMS Packaging için kapak resmi

Yazar

Tai-Ran Hsu, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP003E

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10.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies için kapak resmi

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Yazar

Lee, Ning-Cheng.

Yer Numarası

ONLINE

Elektronik Erişim

Volltext http://www.sciencedirect.com/science/book/9780750672184

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11.

Thermal design of electronic equipment için kapak resmi

Thermal design of electronic equipment

Thermal design of electronic equipment

Yazar

Remsburg, Ralph.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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12.

Run-to-run control in semiconductor manufacturing için kapak resmi

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Yazar

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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